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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
40-526-10

40-526-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

74 -
40-526-10

数据表

Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
28-6554-10

28-6554-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

85 -
28-6554-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
25-0503-30

25-0503-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics

76 -
25-0503-30

数据表

0503 Bulk Active SIP 25 (1 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
110-91-632-41-001000

110-91-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

68 -
110-91-632-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
MPP-1100-05-DS-4GR(S1402)

MPP-1100-05-DS-4GR(S1402)

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

82 -
MPP-1100-05-DS-4GR(S1402)

数据表

- Tray Active Transistor, TO-220 and TO-247 5 (Rectangular) Gold 30.0µin (0.76µm) Nickel Boron Through Hole, Right Angle - - Solder - -65°C ~ 200°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Nickel Boron
24-6554-11

24-6554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

95 -
24-6554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
48-6554-10

48-6554-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

79 -
48-6554-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
40-6554-11

40-6554-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

31 -
40-6554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
228-1277-00-0602J

228-1277-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

21 -
228-1277-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
0804MC

0804MC

CONN TRANSIST TO-3 8POS GOLD

Texas Instruments

30 -
0804MC

数据表

- Tray Active Transistor, TO-3 8 (Oval) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Tin Polyester, Glass Filled 200.0µin (5.08µm) Brass
218-3341-00-0602J

218-3341-00-0602J

CONN IC DIP SOCKET ZIF 18POS GLD

3M

61 -
218-3341-00-0602J

数据表

Textool™ Tray Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
216-7383-55-1902

216-7383-55-1902

CONN SOCKET SOIC 16POS GOLD

3M

58 -
216-7383-55-1902

数据表

Textool™ Bulk Active SOIC 16 (2 x 8) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Gold Polyethersulfone (PES), Glass Filled 30.0µin (0.76µm) Beryllium Copper
232-1287-00-0602J

232-1287-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M

34 -
232-1287-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
210-2599-00-0602

210-2599-00-0602

CONN SOCKET SIP ZIF 10POS GOLD

3M

33 -
210-2599-00-0602

数据表

Textool™ Bulk Active SIP, ZIF (ZIP) 10 (1 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
224-5809-00-0602

224-5809-00-0602

CONN SOCKET SIP ZIF 24POS GOLD

3M

18 -
224-5809-00-0602

数据表

Textool™ Bulk Active SIP, ZIF (ZIP) 24 (1 x 24) Gold - Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
232-2601-00-0602

232-2601-00-0602

CONN SOCKET SIP ZIF 32POS GOLD

3M

11 -
232-2601-00-0602

数据表

Textool™ Bulk Active SIP, ZIF (ZIP) 32 (1 x 32) Gold - Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
108-PRS12005-12

108-PRS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

7 -
108-PRS12005-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
240-5205-00

240-5205-00

CONN SOCKET QFN 40POS GOLD

3M

6 -
240-5205-00

数据表

Textool™ Bulk Active QFN 40 (4 x 10) Gold - Beryllium Copper Through Hole Closed Frame - Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
248-5205-00

248-5205-00

CONN SOCKET QFN 48POS GOLD

3M

13 -
248-5205-00

数据表

Textool™ Bulk Active QFN 48 (4 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.020" (0.50mm) Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
224-5205-01

224-5205-01

CONN SOCKET QFN 24POS GOLD

3M

22 -
224-5205-01

数据表

Textool™ Bulk Active QFN 24 (4x4) Gold - Beryllium Copper Through Hole - 0.020" (0.50mm) Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
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