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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
4818-3000-CP

4818-3000-CP

CONN IC DIP SOCKET 18POS TIN

3M

756 -
4818-3000-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
08-3518-10T

08-3518-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

579 -
08-3518-10T

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICM-324-1-GT-HT

ICM-324-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 24P

Adam Tech

215 -
ICM-324-1-GT-HT

数据表

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
SA183000

SA183000

CONN IC DIP SOCKET 18POS GOLD

On Shore Technology Inc.

769 -
SA183000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
06-0518-10

06-0518-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

717 -
06-0518-10

数据表

518 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICM-628-1-GT-HT

ICM-628-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 28P

Adam Tech

706 -
ICM-628-1-GT-HT

数据表

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
A-CCS 028-Z-SM

A-CCS 028-Z-SM

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components

77 -
A-CCS 028-Z-SM

数据表

- Tube Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyamide (PA9T), Nylon 9T, Glass Filled 160.0µin (4.06µm) Phosphor Bronze
917-47-108-41-005000

917-47-108-41-005000

CONN SOCKET TRANSIST TO-5 8POS

Mill-Max Manufacturing Corp.

87 -
917-47-108-41-005000

数据表

917 Tube Active Transistor, TO-5 8 (Round) Gold Flash Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-47-210-41-005000

917-47-210-41-005000

CONN SOCKET TRANSIST TO-5 10POS

Mill-Max Manufacturing Corp.

31 -
917-47-210-41-005000

数据表

917 Tube Active Transistor, TO-100 10 (Round) Gold Flash Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-308-10-001000

110-43-308-10-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

55 -
110-43-308-10-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4), 4 Loaded Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-308-SGT

ICA-308-SGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

79 -
ICA-308-SGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
XR2A-1611-N

XR2A-1611-N

CONN IC DIP SOCKET 16POS GOLD

Omron Electronics Inc-EMC Div

49 -
XR2A-1611-N

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Beryllium Copper
110-13-318-41-001000

110-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

90 -
110-13-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
123-13-308-41-001000

123-13-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

99 -
123-13-308-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-13-624-41-001000

110-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

48 -
110-13-624-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-99-964-41-001000

110-99-964-41-001000

CONN IC DIP SOCKET 64POS TINLEAD

Mill-Max Manufacturing Corp.

95 -
110-99-964-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-964-41-001000

110-47-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

42 -
110-47-964-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-0518-11

40-0518-11

CONN SOCKET SIP 40POS GOLD

Aries Electronics

85 -
40-0518-11

数据表

518 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
24-526-10

24-526-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

62 -
24-526-10

数据表

Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
24-6554-10

24-6554-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

63 -
24-6554-10

数据表

55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
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