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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APA-640-G-P

APA-640-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-640-G-P

数据表

APA Bulk Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
2174988-1

2174988-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
2174988-1

数据表

- Bulk Obsolete LGA 2011 (47 x 58) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame 0.040" (1.02mm) Solder 0.035" (0.90mm) - Gold Thermoplastic 15.0µin (0.38µm) Copper Alloy
6-1437522-9

6-1437522-9

STAMPED PIN

TE Connectivity AMP Connectors

0 -
6-1437522-9

数据表

- Bulk Active - - - - - - - - - - - - - - -
523-93-121-13-061001

523-93-121-13-061001

PGA SOCK 121PIN 13X13 WIRE WRAP

Mill-Max Manufacturing Corp.

295 -
523-93-121-13-061001

数据表

523 Bulk Active PGA 121 (13 x 13) Gold 30.0µin (0.76µm) - Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) -
21218NE

21218NE

CONN IC DIP SOCKET 8POS

Marutsuelec

2,268 -
21218NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
212014NE

212014NE

CONN IC DIP SOCKET 14POS

Marutsuelec Co., Ltd.

1,214 -
212014NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -30°C ~ 85°C - - - -
212016NE

212016NE

CONN IC DIP SOCKET 16POS

Marutsuelec Co., Ltd.

1,364 -
212016NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -30°C ~ 85°C - - - -
212024WE

212024WE

CONN IC DIP SOCKET 24POS

Marutsuelec Co., Ltd.

1,892 -
212024WE

数据表

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -30°C ~ 85°C - - - -
212114NE

212114NE

CONN IC DIP SOCKET 14POS

Marutsuelec

1,559 -
212114NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
212116NE

212116NE

CONN IC DIP SOCKET 16POS

Marutsuelec

1,764 -
212116NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
212124NE

212124NE

CONN IC DIP SOCKET 24POS

Marutsuelec

489 -
212124NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
212128NE

212128NE

CONN IC DIP SOCKET 28POS

Marutsuelec

1,023 -
212128NE

数据表

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
212132WE

212132WE

CONN IC DIP SOCKET 32POS

Marutsuelec

575 -
212132WE

数据表

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
212140WE

212140WE

CONN IC DIP SOCKET 40POS

Marutsuelec

216 -
212140WE

数据表

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) - - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) -40°C ~ 105°C - - - -
2-1571552-6

2-1571552-6

820-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

2,010 -
2-1571552-6

数据表

800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 180.0µin (4.57µm) Copper
820-AG11D-ESL-LF

820-AG11D-ESL-LF

IC SOCKET, DIP20, 20 CONTACT(S),

TE Connectivity AMP Connectors

2,010 -
820-AG11D-ESL-LF

数据表

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 180.0µin (4.57µm) Copper
3-1571552-2

3-1571552-2

840-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

5,833 -
3-1571552-2

数据表

800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Copper
840-AG11D-ESL-LF

840-AG11D-ESL-LF

IC SOCKET, DIP40, 40 CONTACT(S),

TE Connectivity AMP Connectors

5,833 -
840-AG11D-ESL-LF

数据表

800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Copper
110-87-210-41-001101

110-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

416 -
110-87-210-41-001101

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SA203000

SA203000

CONN IC DIP SOCKET 20POS GOLD

On Shore Technology Inc.

645 -
SA203000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
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