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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1981837-2

1981837-2

CONN SOCKET LGA 1366POS GOLD

TE Connectivity AMP Connectors

0 -
1981837-2

数据表

- Tray Obsolete LGA 1366 (32 x 41) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.040" (1.02mm) Solder 0.040" (1.01mm) - - Thermoplastic - Copper Alloy
APA-316-G-N

APA-316-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-316-G-N

数据表

APA Tube Active - 16 (2 x 8) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
ICO-640-MGT

ICO-640-MGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-MGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
101-93-422-41-560000

101-93-422-41-560000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

486 -
101-93-422-41-560000

数据表

101 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-420-41-001000

110-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

538 -
110-93-420-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-632-10-002000

299-43-632-10-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

300 -
299-43-632-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-424-41-003000

115-43-424-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

488 -
115-43-424-41-003000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICF-640-S-O-TR

ICF-640-S-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-S-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICO-640-NGT

ICO-640-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-NGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
116-93-318-41-007000

116-93-318-41-007000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

892 -
116-93-318-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8059-2G5

8059-2G5

CONN SOCKET TRANSIST TO-5 8POS

TE Connectivity AMP Connectors

0 -
8059-2G5

数据表

- Bulk Obsolete Transistor, TO-5 8 (Round) Gold - Copper Alloy Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polyamide (PA), Nylon - Copper Alloy
2-1437531-2

2-1437531-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1437531-2

数据表

500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold - - Copper Alloy
117-93-628-41-005000

117-93-628-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

193 -
117-93-628-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
3-1437508-1

3-1437508-1

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
3-1437508-1

数据表

8058 Bulk Obsolete Transistor, TO-5 8 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Brass
2-822114-3

2-822114-3

CONN SOCKET PQFP 144POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
2-822114-3

数据表

- Tube Obsolete QFP 144 (4 x 36) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Liquid Crystal Polymer (LCP) 200.0µin (5.08µm) Phosphor Bronze
2201838-2

2201838-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
2201838-2

数据表

- Bulk Obsolete LGA 2011 (47 x 58) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.040" (1.02mm) Solder 0.035" (0.90mm) - Gold Thermoplastic 30.0µin (0.76µm) Copper Alloy
2201838-1

2201838-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
2201838-1

数据表

- Bulk Obsolete LGA 2011 (47 x 58) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame 0.040" (1.02mm) Solder 0.035" (0.90mm) - Gold Thermoplastic 15.0µin (0.38µm) Copper Alloy
ASPI0002-P001A

ASPI0002-P001A

SPI 8Pin WSON 8X6

LOTES

3,430 -
ASPI0002-P001A

数据表

- Tape & Reel (TR) Active SOIC 8 (2 x 4) Gold 15.0µin (0.38µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Liquid Crystal Polymer (LCP) Flash Phosphor Bronze
ASPI0001-P001A

ASPI0001-P001A

SPI 8 PIN_IC 150mil

LOTES

1,710 -
ASPI0001-P001A

数据表

- Tape & Reel (TR) Active SOIC 8 (2 x 4) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Liquid Crystal Polymer (LCP) 1.00µin (0.025µm) Phosphor Bronze
ACA-SPI-004-K01

ACA-SPI-004-K01

SPI 8 PIN_IC 208mil

LOTES

1,660 -
ACA-SPI-004-K01

数据表

- Tape & Reel (TR) Active SOIC 8 (2 x 4) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Liquid Crystal Polymer (LCP) 1.00µin (0.025µm) Phosphor Bronze
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