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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
8080-1G24

8080-1G24

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

380 -
8080-1G24

数据表

- Bulk Obsolete Transistor, TO-3 3 (Round) Tin-Lead 20.0µin (0.51µm) Beryllium Copper Chassis Mount Closed Frame - Solder - -55°C ~ 125°C Tin-Lead Diallyl Phthalate (DAP) 20.0µin (0.51µm) Beryllium Copper
2013620-3

2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

0 -
2013620-3

数据表

- Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame 0.039" (1.00mm) Solder 0.039" (1.00mm) - - Thermoplastic - Copper Alloy
ICO-324-MGT

ICO-324-MGT

100" LOW PROFILE SCREW MACHINE D

Samtec Inc.

0 -
ICO-324-MGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-324-SGG

ICA-324-SGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-SGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
123-43-624-41-801000

123-43-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

167 -
123-43-624-41-801000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-316-NGG

ICO-316-NGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-NGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
9-1437504-0

9-1437504-0

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0 -
9-1437504-0

数据表

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame - Solder - -55°C ~ 125°C Tin Polytetrafluoroethylene (PTFE) 200.0µin (5.08µm) Beryllium Copper
8059-2G9

8059-2G9

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors

0 -
8059-2G9

数据表

8059 Bulk Obsolete Transistor, TO-5 10 (Round) Gold - Copper Alloy Through Hole - - Solder - -55°C ~ 125°C Gold Polyamide (PA), Nylon, Glass Filled - Copper Alloy
ICF-324-S-O

ICF-324-S-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-324-S-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-624-S-O

ICF-624-S-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-S-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICO-628-MGT

ICO-628-MGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

0 -
ICO-628-MGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICF-624-S-O-TR

ICF-624-S-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-S-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICA-324-ZAGT

ICA-324-ZAGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZAGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICO-628-SGG

ICO-628-SGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-628-SGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
8080-1G14

8080-1G14

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

0 -
8080-1G14

数据表

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin-Lead Phenolic - Beryllium Copper
3-1437504-2

3-1437504-2

3-1437504-2

TE Connectivity AMP Connectors

130 -
3-1437504-2

数据表

8080 Box Active Transistor, TO-3 3 (Oval) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin-Lead Phenolic - Beryllium Copper
ICO-320-NGG

ICO-320-NGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-NGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
117-43-668-41-005000

117-43-668-41-005000

CONN IC DIP SOCKET 68POS GOLD

Mill-Max Manufacturing Corp.

198 -
117-43-668-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
2040540-1

2040540-1

CONN SOCKET LGA 1156POS GOLD

TE Connectivity AMP Connectors

0 -
2040540-1

数据表

- Tray Active LGA 1156 (34 x 34) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame 0.036" (0.91mm) Solder 0.039" (1.00mm) - - Thermoplastic - Copper Alloy
ICF-628-S-O

ICF-628-S-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-S-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
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