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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0424-G-T

APH-0424-G-T

APH-0424-G-T

Samtec Inc.

0 -
APH-0424-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0324-G-T

APH-0324-G-T

APH-0324-G-T

Samtec Inc.

0 -
APH-0324-G-T

数据表

* - Active - - - - - - - - - - - - - - -
546-87-304-14-051147

546-87-304-14-051147

CONN SOCKET PGA 304POS GOLD

Preci-Dip

0 -
546-87-304-14-051147

数据表

546 Bulk Active PGA 304 (14 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
HLS-0420-G-2

HLS-0420-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0420-G-2

数据表

HLS Bulk Active SIP 80 (4 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
HLS-0512-T-18

HLS-0512-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0512-T-18

数据表

HLS Bulk Active SIP 60 (5 x 12) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
40-C182-21

40-C182-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-C182-31

40-C182-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
643650-6

643650-6

CONN SOCKET SIP 18POS TIN

TE Connectivity AMP Connectors

0 -
643650-6

数据表

Diplomate DL Tray Obsolete SIP 18 (1 x 18) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Beryllium Copper
ICO-308-ZSGT

ICO-308-ZSGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-308-ZSGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICO-320-STT

ICO-320-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
510-87-081-12-071101

510-87-081-12-071101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

0 -
510-87-081-12-071101

数据表

510 Bulk Active PGA 81 (12 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-636-41-018101

116-87-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
116-87-636-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
20-6513-10

20-6513-10

IC SOCK COLLET CT 20 PIN GOLD

Aries Electronics

0 -
20-6513-10

数据表

513 - Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-312-41-013101

116-87-312-41-013101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-320-TL-I-TR

ICF-320-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-320-TL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
110-83-328-41-105161

110-83-328-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-328-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-624-41-009101

116-87-624-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-624-41-009101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
121-83-422-41-001101

121-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
121-83-422-41-001101

数据表

121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-318-ZSTT

ICA-318-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZSTT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
115-87-650-41-003101

115-87-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
115-87-650-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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