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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
828-AG12D-ES-LF

828-AG12D-ES-LF

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0 -
828-AG12D-ES-LF

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Through Hole, Right Angle, Vertical Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Copper
HLS-0411-G-18

HLS-0411-G-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0411-G-18

数据表

HLS Bulk Active SIP 44 (4 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
40-6503-31

40-6503-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
110-13-652-61-001000

110-13-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-652-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
44-6556-21

44-6556-21

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0 -
44-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
612-13-964-41-001000

612-13-964-41-001000

SOCKET CARRIER SLDRTL .900 64POS

Mill-Max Manufacturing Corp.

0 -
612-13-964-41-001000

数据表

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
510-93-084-11-045003

510-93-084-11-045003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-93-084-11-045003

数据表

510 Tube Active PGA 84 (11 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-83-624-41-105101

117-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
117-83-624-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-93-642-61-008000

116-93-642-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-642-61-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-13-950-41-001000

123-13-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-950-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-13-328-61-801000

110-13-328-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-328-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APH-1422-G-R

APH-1422-G-R

APH-1422-G-R

Samtec Inc.

0 -
APH-1422-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0522-G-R

APH-0522-G-R

APH-0522-G-R

Samtec Inc.

0 -
APH-0522-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1022-G-R

APH-1022-G-R

APH-1022-G-R

Samtec Inc.

0 -
APH-1022-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1122-G-R

APH-1122-G-R

APH-1122-G-R

Samtec Inc.

0 -
APH-1122-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0222-G-R

APH-0222-G-R

APH-0222-G-R

Samtec Inc.

0 -
APH-0222-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1222-G-R

APH-1222-G-R

APH-1222-G-R

Samtec Inc.

0 -
APH-1222-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0822-G-R

APH-0822-G-R

APH-0822-G-R

Samtec Inc.

0 -
APH-0822-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APA-648-G-A

APA-648-G-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-G-A

数据表

APA Bulk Active - 48 (2 x 24) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
517-83-420-19-111111

517-83-420-19-111111

CONN SOCKET PGA 420POS GOLD

Preci-Dip

0 -
517-83-420-19-111111

数据表

517 Bulk Active PGA 420 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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