富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
510-87-072-11-001101

510-87-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

0 -
510-87-072-11-001101

数据表

510 Bulk Active PGA 72 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-072-11-041101

510-87-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

0 -
510-87-072-11-041101

数据表

510 Bulk Active PGA 72 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-072-11-061101

510-87-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

0 -
510-87-072-11-061101

数据表

510 Bulk Active PGA 72 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
PLCC-032-TM-N-TR

PLCC-032-TM-N-TR

CONN SOCKET PLCC 32POS TIN

Samtec Inc.

0 -
PLCC-032-TM-N-TR

数据表

PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) Tin - Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
A-ICS-254-20-TT50

A-ICS-254-20-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
A-ICS-254-20-TT50

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
ICO-324-STT

ICO-324-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
ICO-624-STT

ICO-624-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-STT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
12-1518-00

12-1518-00

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
25-0518-10

25-0518-10

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0518-10

数据表

518 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
123-13-640-41-801000

123-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-640-41-801000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
514-83-321-19-121154

514-83-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
514-83-321-19-121154

数据表

514 Bulk Active PGA 321 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-310-41-013101

116-83-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
40-6556-21

40-6556-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
116-43-652-61-006000

116-43-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-652-61-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-83-636-41-001101

115-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
115-83-636-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-93-652-61-006000

116-93-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-652-61-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-652-61-001000

116-43-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-652-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-428-41-007101

116-87-428-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-428-41-007101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-93-656-61-005000

117-93-656-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-93-656-61-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-6503-21

40-6503-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户