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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
16-0513-11

16-0513-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0513-11

数据表

0513 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
06-0503-20

06-0503-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0503-20

数据表

0503 Bulk Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
06-0503-30

06-0503-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0503-30

数据表

0503 Bulk Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
18-3518-00

18-3518-00

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3518-00

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
15-0518-00

15-0518-00

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0518-00

数据表

518 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
2-1814640-5

2-1814640-5

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
2-1814640-5

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Polyester 30.0µin (0.76µm) Brass
212-1-18-003

212-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

0 -
212-1-18-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
SIP050-1X32-160B

SIP050-1X32-160B

1X32-160B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X32-160B

数据表

SIP050-1x Bulk Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-83-420-41-012101

116-83-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-420-41-012101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-318-41-008101

116-83-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-318-41-035101

146-83-318-41-035101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
146-83-318-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-318-41-036101

146-83-318-41-036101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
146-83-318-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
346-43-107-41-013000

346-43-107-41-013000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-107-41-013000

数据表

346 Bulk Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-308-T-M

APA-308-T-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-T-M

数据表

APA Tube Active - 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
510-87-064-10-051101

510-87-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0 -
510-87-064-10-051101

数据表

510 Bulk Active PGA 64 (10 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-424-41-006101

116-83-424-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-424-41-006101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
824-AG11D-ES

824-AG11D-ES

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
824-AG11D-ES

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
540-44-052-17-400000

540-44-052-17-400000

CONN SOCKET PLCC 52POS TIN

Mill-Max Manufacturing Corp.

0 -
540-44-052-17-400000

数据表

540 Tube Obsolete PLCC 52 (4 x 13) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
122-83-420-41-001101

122-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
122-83-420-41-001101

数据表

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-83-420-41-001101

123-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
123-83-420-41-001101

数据表

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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