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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR 48 HZL/07-TT

AR 48 HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0 -
AR 48 HZL/07-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
08-3518-11H

08-3518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3518-11H

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-87-632-41-018101

116-87-632-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-87-632-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-324-41-002101

116-87-324-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-324-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-648-41-001101

115-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
115-87-648-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
18-3511-10

18-3511-10

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
18-3511-10

数据表

511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
HLS-0112-TT-11

HLS-0112-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-TT-11

数据表

HLS Tube Active SIP 12 (1 x 12) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
SIP050-1X30-160B

SIP050-1X30-160B

1X30-160B-SIP SOCKET 30 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X30-160B

数据表

SIP050-1x Bulk Active SIP 30 (1 x 30) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
25-0513-10T

25-0513-10T

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0513-10T

数据表

0513 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
12-0518-11H

12-0518-11H

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0518-11H

数据表

518 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
12-1518-11H

12-1518-11H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
110-99-648-41-001000

110-99-648-41-001000

CONN IC DIP SOCKET 48POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-648-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-83-324-41-018101

116-83-324-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-324-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-632-41-001101

115-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
115-83-632-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-636-41-001101

110-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
110-83-636-41-001101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-432-41-117101

114-83-432-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
114-83-432-41-117101

数据表

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
299-87-312-10-001101

299-87-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
299-87-312-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-428-41-003101

115-83-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-83-428-41-003101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-44-068-24-000000

540-44-068-24-000000

CONN SOCKET PLCC 68POS TIN

Mill-Max Manufacturing Corp.

0 -
540-44-068-24-000000

数据表

540 Tube Obsolete PLCC 68 (4 x 17) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
IC-316-SGT

IC-316-SGT

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.

0 -
IC-316-SGT

数据表

IC Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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