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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
117-87-430-41-105101

117-87-430-41-105101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

0 -
117-87-430-41-105101

数据表

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D2864-42

D2864-42

CONN IC DIP SOCKET 64POS GOLD

Harwin Inc.

0 -
D2864-42

数据表

D2 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Plastic 196.9µin (5.00µm) Brass
HLS-0208-TT-22

HLS-0208-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0208-TT-22

数据表

HLS Tube Active SIP 16 (2 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
510-87-073-11-061101

510-87-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip

0 -
510-87-073-11-061101

数据表

510 Bulk Active PGA 73 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-316-41-004101

116-87-316-41-004101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
BU200Z-178-HT

BU200Z-178-HT

CONN IC DIP SOCKET 20POS GOLD

On Shore Technology Inc.

0 -
BU200Z-178-HT

数据表

BU-178HT Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
146-87-424-41-036101

146-87-424-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
146-87-424-41-036101

数据表

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-320-STL-O-TR

ICF-320-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-320-STL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-320-STL-I-TR

ICF-320-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-320-STL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
122-87-324-41-001101

122-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
122-87-324-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-87-624-41-035101

146-87-624-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
146-87-624-41-035101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-87-624-41-036101

146-87-624-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
146-87-624-41-036101

数据表

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-044-08-031101

510-83-044-08-031101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

0 -
510-83-044-08-031101

数据表

510 Bulk Active PGA 44 (8 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-632-31-012101

614-87-632-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
614-87-632-31-012101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-4513-11H

08-4513-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-4513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-6513-10T

20-6513-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
21-0518-11

21-0518-11

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0518-11

数据表

518 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
ICA-422-STT

ICA-422-STT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-STT

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
ICO-422-STT

ICO-422-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-STT

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
ICO-322-STT

ICO-322-STT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-322-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
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