富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
HLS-2007-T-10

HLS-2007-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-2007-T-10

数据表

HLS Bulk Active SIP 140 (20 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-83-316-41-001101

116-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-83-316-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
121-83-320-41-001101

121-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
121-83-320-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-628-41-134161

114-83-628-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
114-83-628-41-134161

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
04-0503-31

04-0503-31

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0503-31

数据表

0503 Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
146-87-422-41-035101

146-87-422-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-87-422-41-035101

数据表

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-87-422-41-036101

146-87-422-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-87-422-41-036101

数据表

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-420-41-009101

116-87-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-009101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0203-T-32

HLS-0203-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0203-T-32

数据表

HLS Tube Active SIP 6 (2 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
110-87-428-41-105101

110-87-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-428-41-105101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-424-41-002101

116-87-424-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-424-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-065-10-051101

510-87-065-10-051101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

0 -
510-87-065-10-051101

数据表

510 Bulk Active PGA 65 (10 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-065-10-052101

510-87-065-10-052101

CONN SOCKET PGA 65POS GOLD

Preci-Dip

0 -
510-87-065-10-052101

数据表

510 Bulk Active PGA 65 (10 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-ICS-254-18-TT50

A-ICS-254-18-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
A-ICS-254-18-TT50

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
ICF-320-TL-O-TR

ICF-320-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-320-TL-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
HLS-0107-T-11

HLS-0107-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0107-T-11

数据表

HLS Tube Active SIP 7 (1 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
AR 36-HZL/07-TT

AR 36-HZL/07-TT

SOCKET

Assmann WSW Components

0 -
AR 36-HZL/07-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
116-87-432-41-018101

116-87-432-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
116-87-432-41-018101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-83-324-41-001101

612-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
612-83-324-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0108-T-2

HLS-0108-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0108-T-2

数据表

HLS Tube Active SIP 8 (1 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户