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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
510-87-064-08-000101

510-87-064-08-000101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0 -
510-87-064-08-000101

数据表

510 Bulk Active PGA 64 (8 x 8) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-328-41-117101

114-83-328-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
114-83-328-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-328-41-134161

114-83-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
114-83-328-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
07-0508-20

07-0508-20

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0508-20

数据表

508 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
07-0508-30

07-0508-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0508-30

数据表

508 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
AJ 64-HZL-T

AJ 64-HZL-T

SOCKET

Assmann WSW Components

0 -
AJ 64-HZL-T

数据表

- Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) 196.9µin (5.00µm) Brass
110-83-628-41-005101

110-83-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-628-41-605101

110-83-628-41-605101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-605101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
215-1-14-003

215-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

0 -
215-1-14-003

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
HLS-0203-T-11

HLS-0203-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0203-T-11

数据表

HLS Tube Active SIP 6 (2 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
BU240Z-178-HT

BU240Z-178-HT

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0 -
BU240Z-178-HT

数据表

BU-178HT Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
116-87-420-41-008101

116-87-420-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-008101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-316-STT-L

ICO-316-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-316-STT-L

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
116-83-322-41-003101

116-83-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-322-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-314-41-011101

116-83-314-41-011101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-83-314-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-642-41-001101

115-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
115-87-642-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
18-0513-10H

18-0513-10H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0513-10H

数据表

0513 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-0518-11

20-0518-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0518-11

数据表

518 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
510-87-069-11-001101

510-87-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

0 -
510-87-069-11-001101

数据表

510 Bulk Active PGA 69 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0107-T-10

HLS-0107-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0107-T-10

数据表

HLS Tube Active SIP 7 (1 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
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