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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-636-41-105101

110-87-636-41-105101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
110-87-636-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-210-41-004101

116-83-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-210-41-004101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-610-41-013101

116-87-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-87-648-41-005101

117-87-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
117-87-648-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1-1437542-0

1-1437542-0

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
1-1437542-0

数据表

700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Aluminum Alloy 20.0µin (0.51µm) Beryllium Copper
110-87-314-41-105191

110-87-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-87-314-41-105191

数据表

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0104-G-32

HLS-0104-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0104-G-32

数据表

HLS Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
614-87-636-41-001101

614-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
614-87-636-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-320-41-001101

116-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-320-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
528-AG11D-ES

528-AG11D-ES

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
528-AG11D-ES

数据表

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
116-87-318-41-011101

116-87-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-308-WTT-3

ICA-308-WTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-WTT-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
116-83-624-41-006101

116-83-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-624-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
500-032-050

500-032-050

CONN SOCKET SIP 32POS GOLD

3M

0 -
500-032-050

数据表

- Box Obsolete SIP 32 (1 x 32) Gold 8.00µin (0.203µm) - Through Hole Closed Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - 8.00µin (0.203µm) -
110-83-632-41-005101

110-83-632-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-83-632-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-632-41-605101

110-83-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-83-632-41-605101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-88-084-24-008

540-88-084-24-008

CONN SOCKET PLCC 84POS TIN

Preci-Dip

0 -
540-88-084-24-008

数据表

540 Bulk Active PLCC 84 (4 x 21) Tin - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
21-0513-10

21-0513-10

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0513-10

数据表

0513 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
11-0513-11H

11-0513-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0513-11H

数据表

0513 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
23-0513-10T

23-0513-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0513-10T

数据表

0513 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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