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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
126-41-652-41-001000

126-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-652-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-652-41-001000

126-91-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-652-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-628-G-P

APA-628-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-628-G-P

数据表

APA Tube Active - 28 (2 x 14) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
110-99-432-61-001000

110-99-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-432-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-91-652-41-001000

123-91-652-41-001000

SOCKET IC OPEN 3 LVL .600 52POS

Mill-Max Manufacturing Corp.

0 -
123-91-652-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-41-652-41-001000

123-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-41-652-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
121-11-642-41-001000

121-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-642-41-001000

数据表

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
26-3503-21

26-3503-21

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-3503-21

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
26-3503-31

26-3503-31

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-43-210-61-007000

116-43-210-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-210-61-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-210-61-007000

116-93-210-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-210-61-007000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
1-1437504-0

1-1437504-0

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -
1-1437504-0

数据表

8060 Bulk Obsolete Transistor, TO-5 4 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Beryllium Copper
110-44-310-61-001000

110-44-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-310-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-650-41-001000

614-41-650-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-650-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-650-41-001000

614-91-650-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-650-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-308-61-003000

116-93-308-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-308-61-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-324-G-P

APA-324-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-G-P

数据表

APA Tube Active - 24 (2 x 12) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APA-624-G-P

APA-624-G-P

ADAPTER PLUG

Samtec Inc.

0 -
APA-624-G-P

数据表

APA Tube Active - 24 (2 x 12) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
614-93-648-31-012000

614-93-648-31-012000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

0 -
614-93-648-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-952-41-007000

116-41-952-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-952-41-007000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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