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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
114-93-640-41-117000

114-93-640-41-117000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-640-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-43-640-41-117000

114-43-640-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-640-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0216-G-12

HLS-0216-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0216-G-12

数据表

HLS Tube Active SIP 32 (2 x 16) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
8058-24G1

8058-24G1

CONN TRANSIST TO-5 10POS GOLD

TE Connectivity AMP Connectors

0 -
8058-24G1

数据表

8058 Bulk Obsolete Transistor, TO-5 10 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Brass
HLS-0220-G-2

HLS-0220-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-G-2

数据表

HLS Tube Active SIP 40 (2 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
APA-422-G-N

APA-422-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-422-G-N

数据表

APA Tube Active - 22 (2 x 11) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
1109310-48

1109310-48

SER X55X UNIV ZIF DIP TST SCKT

Aries Electronics

0 -
1109310-48

数据表

- - Active - - - - - - - - - - - - - - -
612-41-322-41-004000

612-41-322-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-322-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-422-41-004000

612-41-422-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-422-41-004000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-322-41-004000

612-91-322-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-322-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-422-41-004000

612-91-422-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-422-41-004000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-328-31-018000

614-41-328-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-328-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-428-31-018000

614-41-428-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-428-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-628-31-018000

614-41-628-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-628-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-328-31-018000

614-91-328-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-328-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-428-31-018000

614-91-428-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-428-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-628-31-018000

614-91-628-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-628-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0936-T-T

APH-0936-T-T

APH-0936-T-T

Samtec Inc.

0 -
APH-0936-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0536-T-T

APH-0536-T-T

APH-0536-T-T

Samtec Inc.

0 -
APH-0536-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1936-T-T

APH-1936-T-T

APH-1936-T-T

Samtec Inc.

0 -
APH-1936-T-T

数据表

* - Active - - - - - - - - - - - - - - -
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