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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0934-T-H

APH-0934-T-H

APH-0934-T-H

Samtec Inc.

0 -
APH-0934-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1434-T-H

APH-1434-T-H

APH-1434-T-H

Samtec Inc.

0 -
APH-1434-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0634-T-H

APH-0634-T-H

APH-0634-T-H

Samtec Inc.

0 -
APH-0634-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1334-T-H

APH-1334-T-H

APH-1334-T-H

Samtec Inc.

0 -
APH-1334-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0334-T-H

APH-0334-T-H

APH-0334-T-H

Samtec Inc.

0 -
APH-0334-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1634-T-H

APH-1634-T-H

APH-1634-T-H

Samtec Inc.

0 -
APH-1634-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0834-T-H

APH-0834-T-H

APH-0834-T-H

Samtec Inc.

0 -
APH-0834-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0734-T-H

APH-0734-T-H

APH-0734-T-H

Samtec Inc.

0 -
APH-0734-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0234-T-H

APH-0234-T-H

APH-0234-T-H

Samtec Inc.

0 -
APH-0234-T-H

数据表

* - Active - - - - - - - - - - - - - - -
116-93-432-41-006000

116-93-432-41-006000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-432-41-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-632-41-006000

116-93-632-41-006000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-632-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-432-41-006000

116-43-432-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-432-41-006000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-632-41-006000

116-43-632-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-632-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-11-320-41-001000

122-11-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-320-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
122-11-420-41-001000

122-11-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-420-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
614-41-328-31-012000

614-41-328-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-328-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-428-31-012000

614-41-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-428-31-012000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-628-31-012000

614-41-628-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-628-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-328-31-012000

614-91-328-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-328-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-428-31-012000

614-91-428-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-428-31-012000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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