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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
HLS-0311-G-12

HLS-0311-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0311-G-12

数据表

HLS Tube Active SIP 33 (3 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
614-41-328-31-007000

614-41-328-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-328-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-428-31-007000

614-41-428-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-428-31-007000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-628-31-007000

614-41-628-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-628-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-328-31-007000

614-91-328-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-328-31-007000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-428-31-007000

614-91-428-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-428-31-007000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-628-31-007000

614-91-628-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-628-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-151-31-018000

714-43-151-31-018000

CONN SOCKET SIP 51POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-151-31-018000

数据表

714 Bulk Active SIP 51 (1 x 51) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
APH-0210-G-R

APH-0210-G-R

APH-0210-G-R

Samtec Inc.

0 -
APH-0210-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0910-G-R

APH-0910-G-R

APH-0910-G-R

Samtec Inc.

0 -
APH-0910-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1310-G-R

APH-1310-G-R

APH-1310-G-R

Samtec Inc.

0 -
APH-1310-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1810-G-R

APH-1810-G-R

APH-1810-G-R

Samtec Inc.

0 -
APH-1810-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1610-G-R

APH-1610-G-R

APH-1610-G-R

Samtec Inc.

0 -
APH-1610-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1410-G-R

APH-1410-G-R

APH-1410-G-R

Samtec Inc.

0 -
APH-1410-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1710-G-R

APH-1710-G-R

APH-1710-G-R

Samtec Inc.

0 -
APH-1710-G-R

数据表

* - Active - - - - - - - - - - - - - - -
28-6823-90

28-6823-90

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
30-0501-30

30-0501-30

CONN SOCKET SIP 30POS TIN

Aries Electronics

0 -
30-0501-30

数据表

501 Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
32-6508-302

32-6508-302

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6508-302

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-83-100-10-000112

614-83-100-10-000112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
614-83-100-10-000112

数据表

614 Bulk Active PGA 100 (10 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
26-6621-30

26-6621-30

CONN IC DIP SOCKET 26POS TIN

Aries Electronics

0 -
26-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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