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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
510-83-300-21-001101

510-83-300-21-001101

CONN SOCKET PGA 300POS GOLD

Preci-Dip

0 -
510-83-300-21-001101

数据表

510 Bulk Active PGA 300 (21 x 21) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-11-642-41-001000

110-11-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-11-642-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
315-13-132-41-003000

315-13-132-41-003000

SOCKET LOW PROFILE SIP 32POS

Mill-Max Manufacturing Corp.

0 -
315-13-132-41-003000

数据表

315 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
27-7500-10

27-7500-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

0 -
27-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
27-7530-10

27-7530-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

0 -
27-7530-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
27-7550-10

27-7550-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

0 -
27-7550-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
27-7650-10

27-7650-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

0 -
27-7650-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
612-11-320-41-001000

612-11-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-320-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
121-11-324-41-001000

121-11-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-324-41-001000

数据表

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
121-11-424-41-001000

121-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-424-41-001000

数据表

121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
121-11-624-41-001000

121-11-624-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-624-41-001000

数据表

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
HLS-0314-G-22

HLS-0314-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0314-G-22

数据表

HLS Tube Active SIP 42 (3 x 14) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
40-6508-302

40-6508-302

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-302

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APA-632-T-B

APA-632-T-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-T-B

数据表

APA Bulk Active - 32 (2 x 16) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APO-632-T-B

APO-632-T-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-632-T-B

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
612-43-318-41-004000

612-43-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-318-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-318-41-004000

612-93-318-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-318-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-322-41-001000

116-93-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-322-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-422-41-001000

116-93-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-422-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-322-41-001000

116-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-322-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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