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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1036-T-T

APH-1036-T-T

APH-1036-T-T

Samtec Inc.

0 -
APH-1036-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1536-T-T

APH-1536-T-T

APH-1536-T-T

Samtec Inc.

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APH-1536-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1236-T-T

APH-1236-T-T

APH-1236-T-T

Samtec Inc.

0 -
APH-1236-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1336-T-T

APH-1336-T-T

APH-1336-T-T

Samtec Inc.

0 -
APH-1336-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0436-T-T

APH-0436-T-T

APH-0436-T-T

Samtec Inc.

0 -
APH-0436-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0336-T-T

APH-0336-T-T

APH-0336-T-T

Samtec Inc.

0 -
APH-0336-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0636-T-T

APH-0636-T-T

APH-0636-T-T

Samtec Inc.

0 -
APH-0636-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1136-T-T

APH-1136-T-T

APH-1136-T-T

Samtec Inc.

0 -
APH-1136-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0236-T-T

APH-0236-T-T

APH-0236-T-T

Samtec Inc.

0 -
APH-0236-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0736-T-T

APH-0736-T-T

APH-0736-T-T

Samtec Inc.

0 -
APH-0736-T-T

数据表

* - Active - - - - - - - - - - - - - - -
110-43-640-41-105000

110-43-640-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-640-41-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-83-100-13-062112

614-83-100-13-062112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

0 -
614-83-100-13-062112

数据表

614 Bulk Active PGA 100 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-47-652-41-005000

117-47-652-41-005000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
117-47-652-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
20-810-90

20-810-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
510-83-299-20-001101

510-83-299-20-001101

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
510-83-299-20-001101

数据表

510 Bulk Active PGA 299 (20 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-299-20-091101

510-83-299-20-091101

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
510-83-299-20-091101

数据表

510 Bulk Active PGA 299 (20 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-93-652-41-001000

110-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-652-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-652-41-001000

110-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-652-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-93-632-41-012000

146-93-632-41-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
146-93-632-41-012000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-43-632-41-012000

146-43-632-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-43-632-41-012000

数据表

146 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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