富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0332-T-H

APH-0332-T-H

APH-0332-T-H

Samtec Inc.

0 -
APH-0332-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1332-T-H

APH-1332-T-H

APH-1332-T-H

Samtec Inc.

0 -
APH-1332-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0832-T-H

APH-0832-T-H

APH-0832-T-H

Samtec Inc.

0 -
APH-0832-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1732-T-H

APH-1732-T-H

APH-1732-T-H

Samtec Inc.

0 -
APH-1732-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1132-T-H

APH-1132-T-H

APH-1132-T-H

Samtec Inc.

0 -
APH-1132-T-H

数据表

* - Active - - - - - - - - - - - - - - -
48-6518-10E

48-6518-10E

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6518-10E

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-93-432-41-105000

110-93-432-41-105000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-432-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-432-41-105000

110-43-432-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-432-41-105000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-632-41-105000

110-43-632-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-632-41-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-422-41-801000

123-93-422-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-93-422-41-801000

数据表

123 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-322-41-780000

104-11-322-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-322-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
104-11-422-41-780000

104-11-422-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-422-41-780000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
510-83-281-19-081101

510-83-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip

0 -
510-83-281-19-081101

数据表

510 Bulk Active PGA 281 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APO-628-G-A

APO-628-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-G-A

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-47-640-41-006000

116-47-640-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-640-41-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-3551-10

40-3551-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-3551-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
40-3552-10

40-3552-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-3552-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
40-3553-10

40-3553-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-3553-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
40-6551-10

40-6551-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6551-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
40-6552-10

40-6552-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6552-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户