富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0712-G-R

APH-0712-G-R

APH-0712-G-R

Samtec Inc.

0 -
APH-0712-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0412-G-R

APH-0412-G-R

APH-0412-G-R

Samtec Inc.

0 -
APH-0412-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1612-G-R

APH-1612-G-R

APH-1612-G-R

Samtec Inc.

0 -
APH-1612-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0812-G-R

APH-0812-G-R

APH-0812-G-R

Samtec Inc.

0 -
APH-0812-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1712-G-R

APH-1712-G-R

APH-1712-G-R

Samtec Inc.

0 -
APH-1712-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1212-G-R

APH-1212-G-R

APH-1212-G-R

Samtec Inc.

0 -
APH-1212-G-R

数据表

* - Active - - - - - - - - - - - - - - -
210-11-632-41-001000

210-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-11-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
114-93-432-41-117000

114-93-432-41-117000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-432-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-93-632-41-117000

114-93-632-41-117000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
114-93-632-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-43-432-41-117000

114-43-432-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-432-41-117000

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-43-632-41-117000

114-43-632-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-43-632-41-117000

数据表

114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-93-161-41-013000

346-93-161-41-013000

CONN SOCKET SIP 61POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-161-41-013000

数据表

346 Bulk Active SIP 61 (1 x 61) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-161-41-013000

346-43-161-41-013000

CONN SOCKET SIP 61POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-161-41-013000

数据表

346 Bulk Active SIP 61 (1 x 61) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-316-41-780000

104-13-316-41-780000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-316-41-780000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
HLS-0313-G-22

HLS-0313-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0313-G-22

数据表

HLS Tube Active SIP 39 (3 x 13) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
HLS-0312-G-11

HLS-0312-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0312-G-11

数据表

HLS Tube Active SIP 36 (3 x 12) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
510-83-280-19-081101

510-83-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip

0 -
510-83-280-19-081101

数据表

510 Bulk Active PGA 280 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
24-3571-10

24-3571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3571-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
24-3572-10

24-3572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3572-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
24-3573-10

24-3573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3573-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户