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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
612-91-316-41-004000

612-91-316-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-316-41-004000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-324-41-007000

116-93-324-41-007000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-324-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-424-41-007000

116-93-424-41-007000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-424-41-007000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-624-41-007000

116-93-624-41-007000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-624-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-324-41-007000

116-43-324-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-324-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-424-41-007000

116-43-424-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-424-41-007000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-624-41-007000

116-43-624-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-624-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-648-NGT

ICO-648-NGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-NGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0409-G-2

HLS-0409-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0409-G-2

数据表

HLS Bulk Active SIP 36 (4 x 9) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
APH-0432-T-T

APH-0432-T-T

APH-0432-T-T

Samtec Inc.

0 -
APH-0432-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1432-T-T

APH-1432-T-T

APH-1432-T-T

Samtec Inc.

0 -
APH-1432-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1932-T-T

APH-1932-T-T

APH-1932-T-T

Samtec Inc.

0 -
APH-1932-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1032-T-T

APH-1032-T-T

APH-1032-T-T

Samtec Inc.

0 -
APH-1032-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1532-T-T

APH-1532-T-T

APH-1532-T-T

Samtec Inc.

0 -
APH-1532-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1632-T-T

APH-1632-T-T

APH-1632-T-T

Samtec Inc.

0 -
APH-1632-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1332-T-T

APH-1332-T-T

APH-1332-T-T

Samtec Inc.

0 -
APH-1332-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1732-T-T

APH-1732-T-T

APH-1732-T-T

Samtec Inc.

0 -
APH-1732-T-T

数据表

* - Active - - - - - - - - - - - - - - -
115-93-636-41-001000

115-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-636-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-636-41-001000

115-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-636-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-148-31-018000

714-43-148-31-018000

CONN SOCKET SIP 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-148-31-018000

数据表

714 Bulk Active SIP 48 (1 x 48) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
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