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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
510-83-279-19-081101

510-83-279-19-081101

CONN SOCKET PGA 279POS GOLD

Preci-Dip

0 -
510-83-279-19-081101

数据表

510 Bulk Active PGA 279 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
40-3503-20

40-3503-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
40-3503-30

40-3503-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
116-47-322-41-001000

116-47-322-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-322-41-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-422-41-001000

116-47-422-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-422-41-001000

数据表

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-93-306-11-001000

299-93-306-11-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
299-93-306-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-324-31-018000

614-41-324-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-324-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-424-31-018000

614-41-424-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-424-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-624-31-018000

614-41-624-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-624-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-324-31-018000

614-91-324-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-324-31-018000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-424-31-018000

614-91-424-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-424-31-018000

数据表

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-624-31-018000

614-91-624-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-624-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
38-3513-11H

38-3513-11H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

0 -
38-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APH-1512-G-R

APH-1512-G-R

APH-1512-G-R

Samtec Inc.

0 -
APH-1512-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1012-G-R

APH-1012-G-R

APH-1012-G-R

Samtec Inc.

0 -
APH-1012-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0512-G-R

APH-0512-G-R

APH-0512-G-R

Samtec Inc.

0 -
APH-0512-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1912-G-R

APH-1912-G-R

APH-1912-G-R

Samtec Inc.

0 -
APH-1912-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0612-G-R

APH-0612-G-R

APH-0612-G-R

Samtec Inc.

0 -
APH-0612-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1112-G-R

APH-1112-G-R

APH-1112-G-R

Samtec Inc.

0 -
APH-1112-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0312-G-R

APH-0312-G-R

APH-0312-G-R

Samtec Inc.

0 -
APH-0312-G-R

数据表

* - Active - - - - - - - - - - - - - - -
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