富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
24-3574-10

24-3574-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3574-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
24-6571-10

24-6571-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-6571-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
24-6572-10

24-6572-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-6572-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
24-6573-10

24-6573-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-6573-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
546-87-149-15-063135

546-87-149-15-063135

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0 -
546-87-149-15-063135

数据表

546 Bulk Active PGA 149 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-87-149-15-063136

546-87-149-15-063136

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0 -
546-87-149-15-063136

数据表

546 Bulk Active PGA 149 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
32-3574-10

32-3574-10

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
32-3574-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
605-93-322-11-480000

605-93-322-11-480000

SOCKET CARRIER LOWPRO .300 22POS

Mill-Max Manufacturing Corp.

0 -
605-93-322-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-93-422-11-480000

605-93-422-11-480000

SOCKET CARRIER LOWPRO .400 22POS

Mill-Max Manufacturing Corp.

0 -
605-93-422-11-480000

数据表

605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-322-11-480000

605-43-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-322-11-480000

数据表

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-43-422-11-480000

605-43-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-43-422-11-480000

数据表

605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-ZMGG

ICO-640-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-ZMGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
346-99-132-41-013000

346-99-132-41-013000

CONN SOCKET SIP 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
346-99-132-41-013000

数据表

346 Tube Active SIP 32 (1 x 32) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
311-13-120-41-001000

311-13-120-41-001000

SOCKET LONG SOLDERTAIL SIP 20POS

Mill-Max Manufacturing Corp.

0 -
311-13-120-41-001000

数据表

311 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APH-1832-T-H

APH-1832-T-H

APH-1832-T-H

Samtec Inc.

0 -
APH-1832-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0432-T-H

APH-0432-T-H

APH-0432-T-H

Samtec Inc.

0 -
APH-0432-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0932-T-H

APH-0932-T-H

APH-0932-T-H

Samtec Inc.

0 -
APH-0932-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1532-T-H

APH-1532-T-H

APH-1532-T-H

Samtec Inc.

0 -
APH-1532-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0632-T-H

APH-0632-T-H

APH-0632-T-H

Samtec Inc.

0 -
APH-0632-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1232-T-H

APH-1232-T-H

APH-1232-T-H

Samtec Inc.

0 -
APH-1232-T-H

数据表

* - Active - - - - - - - - - - - - - - -
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户