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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APO-310-G-A1

APO-310-G-A1

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-310-G-A1

数据表

* - Active - - - - - - - - - - - - - - -
114-41-308-41-117000

114-41-308-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-308-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-308-41-117000

114-91-308-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-308-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
11-0501-21

11-0501-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0501-21

数据表

501 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
11-0501-31

11-0501-31

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0501-31

数据表

501 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
24-516-11

24-516-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0 -
24-516-11

数据表

516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
116-43-304-61-003000

116-43-304-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-304-61-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-304-61-003000

116-93-304-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-304-61-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-310-41-006000

116-47-310-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-310-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-91-105-41-005000

317-91-105-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-105-41-005000

数据表

317 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICF-632-SM-O

ICF-632-SM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-632-SM-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
26-823-90C

26-823-90C

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

0 -
26-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
510-83-207-17-081101

510-83-207-17-081101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

0 -
510-83-207-17-081101

数据表

510 Bulk Active PGA 207 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-207-17-082101

510-83-207-17-082101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

0 -
510-83-207-17-082101

数据表

510 Bulk Active PGA 207 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-41-210-41-001000

115-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-210-41-001000

数据表

115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-210-41-001000

115-91-210-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-210-41-001000

数据表

115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-3508-20

24-3508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3508-20

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
24-3508-30

24-3508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3508-30

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
24-6508-20

24-6508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6508-20

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
24-6508-30

24-6508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6508-30

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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