富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
28-3513-11H

28-3513-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
14-810-90WR

14-810-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-810-90WR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
114-41-310-41-117000

114-41-310-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-310-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-310-41-117000

114-91-310-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-310-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
20-822-90TWR

20-822-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
20-822-90TWR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
HLS-0220-T-2

HLS-0220-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-T-2

数据表

HLS Tube Active SIP 40 (2 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
ICA-320-WGG

ICA-320-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-WGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
23-0501-20

23-0501-20

CONN SOCKET SIP 23POS TIN

Aries Electronics

0 -
23-0501-20

数据表

501 Bulk Active SIP 23 (1 x 23) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
ICO-632-SGG-L

ICO-632-SGG-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-SGG-L

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
116-41-306-41-007000

116-41-306-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-306-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-306-41-007000

116-91-306-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-306-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0211-G-12

HLS-0211-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0211-G-12

数据表

HLS Tube Active SIP 22 (2 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
614-83-069-11-061112

614-83-069-11-061112

CONN SOCKET PGA 69POS GOLD

Preci-Dip

0 -
614-83-069-11-061112

数据表

614 Bulk Active PGA 69 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-93-306-41-013000

146-93-306-41-013000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
146-93-306-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-43-306-41-013000

146-43-306-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-43-306-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-640-ZSGT-L

ICA-640-ZSGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZSGT-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
104-11-306-41-770000

104-11-306-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-306-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
114-41-210-41-117000

114-41-210-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-210-41-117000

数据表

114 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-210-41-117000

114-91-210-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-210-41-117000

数据表

114 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APO-624-T-T

APO-624-T-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-624-T-T

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户