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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
18-7740-10

18-7740-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-7740-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
210-43-310-41-001000

210-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-43-310-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-628-ZWGT

ICA-628-ZWGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZWGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
116-47-306-41-007000

116-47-306-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-306-41-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-91-104-41-005000

317-91-104-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-104-41-005000

数据表

317 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-47-210-41-001000

111-47-210-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
111-47-210-41-001000

数据表

111 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-43-102-41-005000

317-43-102-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
317-43-102-41-005000

数据表

317 Bulk Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
20-7490-11

20-7490-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-7490-11

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
20-7600-11

20-7600-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-7600-11

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
ICA-624-WGG-2

ICA-624-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-WGG-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
110-41-210-41-105000

110-41-210-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-210-41-105000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-310-41-105000

110-41-310-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-310-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-210-41-105000

110-91-210-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-210-41-105000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-310-41-105000

110-91-310-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-310-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0217-T-30

HLS-0217-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0217-T-30

数据表

HLS Tube Active SIP 34 (2 x 17) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-87-648-41-013101

116-87-648-41-013101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
116-87-648-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-322-JGG

ICO-322-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-322-JGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
17-0503-21

17-0503-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0503-21

数据表

0503 Bulk Active SIP 17 (1 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
17-0503-31

17-0503-31

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0503-31

数据表

0503 Bulk Active SIP 17 (1 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
20-6823-90

20-6823-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
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