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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-93-306-41-605000

110-93-306-41-605000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-306-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-306-41-605000

110-43-306-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-306-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-41-210-41-001000

111-41-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-210-41-001000

数据表

111 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-210-41-001000

111-91-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-210-41-001000

数据表

111 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-310-41-001000

115-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
115-93-310-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-306-41-006000

116-93-306-41-006000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-306-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-306-41-006000

116-43-306-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-306-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-420-41-001000

110-99-420-41-001000

CONN IC DIP SOCKET 20POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-420-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-420-41-001000

110-44-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-420-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-134-31-018000

714-43-134-31-018000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-134-31-018000

数据表

714 Bulk Active SIP 34 (1 x 34) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
317-47-106-41-005000

317-47-106-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-106-41-005000

数据表

317 Bulk Active SIP 6 (1 x 6) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-324-ZAGG

ICA-324-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZAGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICA-624-ZAGG

ICA-624-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-ZAGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
30-6503-30

30-6503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
317-93-102-41-005000

317-93-102-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-93-102-41-005000

数据表

317 Bulk Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-87-088-13-062112

614-87-088-13-062112

CONN SOCKET PGA 88POS GOLD

Preci-Dip

0 -
614-87-088-13-062112

数据表

614 Bulk Active PGA 88 (13 x 13) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-208-17-081101

510-83-208-17-081101

CONN SOCKET PGA 208POS GOLD

Preci-Dip

0 -
510-83-208-17-081101

数据表

510 Bulk Active PGA 208 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
268-5401-11-1102JH

268-5401-11-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

0 -
268-5401-11-1102JH

数据表

OEM Bulk Obsolete CLCC 68 (4 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyphenylene Sulfide (PPS), Glass Filled 30.0µin (0.76µm) Beryllium Copper
36-3513-11

36-3513-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8439-310C

16-8439-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8439-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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