富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1316-T-R

APH-1316-T-R

APH-1316-T-R

Samtec Inc.

0 -
APH-1316-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1216-T-R

APH-1216-T-R

APH-1216-T-R

Samtec Inc.

0 -
APH-1216-T-R

数据表

* - Active - - - - - - - - - - - - - - -
110-43-310-41-001000

110-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-310-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-628-ZAGG

ICA-628-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZAGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICO-628-ZAGG

ICO-628-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-628-ZAGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
36-6513-11H

36-6513-11H

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
32-0508-20

32-0508-20

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0508-20

数据表

508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
32-0508-30

32-0508-30

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
32-0508-30

数据表

508 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
32-1508-20

32-1508-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-1508-20

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
32-1508-30

32-1508-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
210-99-314-41-001000

210-99-314-41-001000

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
210-99-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-44-314-41-001000

210-44-314-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-47-210-41-001000

115-47-210-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-210-41-001000

数据表

115 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-47-308-41-117000

114-47-308-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-308-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-306-41-003000

116-41-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-306-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-306-41-003000

116-91-306-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-306-41-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-71000-10

18-71000-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-71000-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
18-7500-10

18-7500-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
18-7625-10

18-7625-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-7625-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
18-7650-10

18-7650-10

CONN SOCKET SIP 18POS TIN

Aries Electronics

0 -
18-7650-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户