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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
111-41-306-41-001000

111-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-41-306-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-91-306-41-001000

111-91-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-91-306-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-KGT

ICO-640-KGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-KGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-640-KGT

ICA-640-KGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-KGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
510-83-196-14-000101

510-83-196-14-000101

CONN SOCKET PGA 196POS GOLD

Preci-Dip

0 -
510-83-196-14-000101

数据表

510 Bulk Active PGA 196 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-93-304-61-105000

110-93-304-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-304-61-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-99-308-41-001000

210-99-308-41-001000

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
210-99-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-44-308-41-001000

210-44-308-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
16-0508-21

16-0508-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0508-21

数据表

508 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
16-0508-31

16-0508-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0508-31

数据表

508 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
ICA-648-ZSGT

ICA-648-ZSGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZSGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0120-G-10

HLS-0120-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-G-10

数据表

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
16-1508-21

16-1508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
16-1508-31

16-1508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
38-6501-20

38-6501-20

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

0 -
38-6501-20

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
HLS-0312-T-10

HLS-0312-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0312-T-10

数据表

HLS Tube Active SIP 36 (3 x 12) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
346-93-141-41-013000

346-93-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-141-41-013000

数据表

346 Bulk Active SIP 41 (1 x 41) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-141-41-013000

346-43-141-41-013000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-141-41-013000

数据表

346 Bulk Active SIP 41 (1 x 41) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-318-JGG

ICA-318-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-JGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
31-0508-20

31-0508-20

CONN SOCKET SIP 31POS GOLD

Aries Electronics

0 -
31-0508-20

数据表

508 Bulk Active SIP 31 (1 x 31) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
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