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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
264-4493-00-0602J

264-4493-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M

37 -
264-4493-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
225-PRS15001-12

225-PRS15001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

30 -
225-PRS15001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) 225 (15 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
289-PRS17001-12

289-PRS17001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

34 -
289-PRS17001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
240-5205-01

240-5205-01

CONN SOCKET QFN 40POS GOLD

3M

27 -
240-5205-01

数据表

Textool™ Bulk Active QFN 40 (4 x 10) Gold - Beryllium Copper Through Hole Closed Frame - Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
ICS-306-T

ICS-306-T

IC SOCKET, DIP, 6P 2.54MM PITCH

Adam Tech

7,748 -
ICS-306-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ICS-308-T

ICS-308-T

IC SOCKET, DIP, 8P 2.54MM PITCH

Adam Tech

10,424 -
ICS-308-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ICS-314-T

ICS-314-T

IC SOCKET, DIP, 14P 2.54MM PITCH

Adam Tech

2,629 -
ICS-314-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ICS-316-T

ICS-316-T

IC SOCKET, DIP, 16P 2.54MM PITCH

Adam Tech

21,453 -
ICS-316-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ICS-318-T

ICS-318-T

IC SOCKET, DIP, 18P 2.54MM PITCH

Adam Tech

9,810 -
ICS-318-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ED14DT

ED14DT

CONN IC DIP SOCKET 14POS TIN

On Shore Technology Inc.

10,684 -
ED14DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
ICS-320-T

ICS-320-T

IC SOCKET, DIP, 20P 2.54MM PITCH

Adam Tech

9,010 -
ICS-320-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
A 08-LC-TR

A 08-LC-TR

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components

4,012 -
A 08-LC-TR

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
AR 06-HZL-TT

AR 06-HZL-TT

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components

5,612 -
AR 06-HZL-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
245-08-1-03

245-08-1-03

CONN IC DIP SOCKET 8POS TIN

CNC Tech

3,915 -
245-08-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
ICS-324-T

ICS-324-T

IC SOCKET, DIP, 24P 2.54MM PITCH

Adam Tech

1,884 -
ICS-324-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
1-2199298-1

1-2199298-1

CONN IC DIP SOCKET 6POS TIN

TE Connectivity AMP Connectors

6,487 -
1-2199298-1

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
1-2199298-3

1-2199298-3

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

8,658 -
1-2199298-3

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
DILB8P-223TLF

DILB8P-223TLF

CONN IC DIP SOCKET 8POS TIN

Amphenol ICC (FCI)

3,490 -
DILB8P-223TLF

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA), Nylon 100.0µin (2.54µm) Copper Alloy
ED40DT

ED40DT

CONN IC DIP SOCKET 40POS TIN

On Shore Technology Inc.

0 -
ED40DT

数据表

ED Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
ICS-328-T

ICS-328-T

IC SOCKET, DIP, 28P 2.54MM PITCH

Adam Tech

3,016 -
ICS-328-T

数据表

ICS Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
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