富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICS-628-T

ICS-628-T

IC SOCKET, DIP, 28P 2.54MM PITCH

Adam Tech

2,969 -
ICS-628-T

数据表

ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
1-2199298-4

1-2199298-4

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

3,880 -
1-2199298-4

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
ED24DT

ED24DT

CONN IC DIP SOCKET 24POS TIN

On Shore Technology Inc.

7,688 -
ED24DT

数据表

ED Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
A 14-LC-TR

A 14-LC-TR

CONN IC DIP SOCKET 14POS TIN

Assmann WSW Components

3,787 -
A 14-LC-TR

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
ED08DT

ED08DT

CONN IC DIP SOCKET 8POS TIN

On Shore Technology Inc.

3,344 -
ED08DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
243-08-1-03

243-08-1-03

CONN IC DIP SOCKET 8POS TIN

CNC Tech

9,404 -
243-08-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
243-06-1-03

243-06-1-03

CONN IC DIP SOCKET 6POS TIN

CNC Tech

5,369 -
243-06-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
A 16-LC-TR

A 16-LC-TR

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

3,935 -
A 16-LC-TR

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
ED18DT

ED18DT

CONN IC DIP SOCKET 18POS TIN

On Shore Technology Inc.

1,488 -
ED18DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
DILB18P-223TLF

DILB18P-223TLF

CONN IC DIP SOCKET 18POS TINLEAD

Amphenol ICC (FCI)

10,058 -
DILB18P-223TLF

数据表

DILB Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polyamide (PA), Nylon 100.0µin (2.54µm) Copper Alloy
110-87-304-41-001101

110-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

8,702 -
110-87-304-41-001101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DILB16P-223TLF

DILB16P-223TLF

CONN IC DIP SOCKET 16POS TIN

Amphenol ICC (FCI)

4,782 -
DILB16P-223TLF

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA), Nylon 100.0µin (2.54µm) Copper Alloy
A 18-LC-TT

A 18-LC-TT

CONN IC DIP SOCKET 18POS TIN

Assmann WSW Components

7,873 -
A 18-LC-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
A 18-LC-TR

A 18-LC-TR

CONN IC DIP SOCKET 18POS TIN

Assmann WSW Components

3,037 -
A 18-LC-TR

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
243-14-1-03

243-14-1-03

CONN IC DIP SOCKET 14POS TIN

CNC Tech

2,891 -
243-14-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
1-2199298-5

1-2199298-5

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors

2,498 -
1-2199298-5

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
ED28DT

ED28DT

CONN IC DIP SOCKET 28POS TIN

On Shore Technology Inc.

7,399 -
ED28DT

数据表

ED Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
243-16-1-03

243-16-1-03

CONN IC DIP SOCKET 16POS TIN

CNC Tech

4,330 -
243-16-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
245-14-1-03

245-14-1-03

CONN IC DIP SOCKET 14POS TIN

CNC Tech

2,859 -
245-14-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
ED241DT

ED241DT

CONN IC DIP SOCKET 24POS TIN

On Shore Technology Inc.

2,669 -
ED241DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
共 19086 条记录«上一页123456789...955下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户