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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
A-CCS 044-Z-T

A-CCS 044-Z-T

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components

7,055 -
A-CCS 044-Z-T

数据表

- Tube Active PLCC 44 (4 x 11) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
D01-9972042

D01-9972042

CONN SOCKET SIP 20POS GOLD

Harwin Inc.

8,730 -
D01-9972042

数据表

D01-997 Tube Active SIP 20 (1 x 20) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
110-44-424-41-001000

110-44-424-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

1,703 -
110-44-424-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
940-44-032-17-400000

940-44-032-17-400000

CONN SOCKET PLCC 32POS TIN

Mill-Max Manufacturing Corp.

1,810 -
940-44-032-17-400000

数据表

940 Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
10-3513-10

10-3513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1,452 -
10-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-13-308-41-001000

110-13-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

600 -
110-13-308-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
D2816-42

D2816-42

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

2,770 -
D2816-42

数据表

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Plastic 196.9µin (5.00µm) Brass
214-44-314-01-670800

214-44-314-01-670800

CONN IC DIP SOCKET 14POS TIN

Mill-Max Manufacturing Corp.

9,045 -
214-44-314-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
SA406000

SA406000

CONN IC DIP SOCKET 40POS GOLD

On Shore Technology Inc.

1,417 -
SA406000

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
8432-21B1-RK-TP

8432-21B1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

2,433 -
8432-21B1-RK-TP

数据表

8400 Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
08-3518-00

08-3518-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

947 -
08-3518-00

数据表

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-43-314-41-001000

110-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3,002 -
110-43-314-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-314-41-001000

110-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,715 -
110-93-314-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-328-41-001000

110-44-328-41-001000

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.

1,520 -
110-44-328-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-628-41-001000

110-44-628-41-001000

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.

1,002 -
110-44-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
940-44-044-17-400000

940-44-044-17-400000

CONN SOCKET PLCC 44POS TIN

Mill-Max Manufacturing Corp.

4,947 -
940-44-044-17-400000

数据表

940 Tube Active PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8444-11B1-RK-TP

8444-11B1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

1,492 -
8444-11B1-RK-TP

数据表

8400 Tube Active PLCC 44 (4 x 11) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
8444-21B1-RK-TP

8444-21B1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

2,201 -
8444-21B1-RK-TP

数据表

8400 Tube Active PLCC 44 (4 x 11) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
A-CCS 068-Z-T

A-CCS 068-Z-T

CONN SOCKET PLCC 68POS TIN

Assmann WSW Components

1,252 -
A-CCS 068-Z-T

数据表

- Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
917-43-103-41-005000

917-43-103-41-005000

CONN TRANSIST TO-5 3POS GOLD

Mill-Max Manufacturing Corp.

932 -
917-43-103-41-005000

数据表

917 Tube Active Transistor, TO-5 3 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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