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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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A-CCS 044-Z-TCONN SOCKET PLCC 44POS TIN |
7,055 | - |
|
数据表 |
- | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
|
|
D01-9972042CONN SOCKET SIP 20POS GOLD |
8,730 | - |
|
数据表 |
D01-997 | Tube | Active | SIP | 20 (1 x 20) | Gold | Flash | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 196.9µin (5.00µm) | Brass |
|
110-44-424-41-001000CONN IC DIP SOCKET 24POS TIN |
1,703 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
940-44-032-17-400000CONN SOCKET PLCC 32POS TIN |
1,810 | - |
|
数据表 |
940 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
10-3513-10CONN IC DIP SOCKET 10POS GOLD |
1,452 | - |
|
数据表 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
110-13-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
600 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
|
D2816-42CONN IC DIP SOCKET 16POS GOLD |
2,770 | - |
|
数据表 |
D2 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Plastic | 196.9µin (5.00µm) | Brass |
|
214-44-314-01-670800CONN IC DIP SOCKET 14POS TIN |
9,045 | - |
|
数据表 |
214 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
SA406000CONN IC DIP SOCKET 40POS GOLD |
1,417 | - |
|
数据表 |
SA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
|
8432-21B1-RK-TPCONN SOCKET PLCC 32POS TIN |
2,433 | - |
|
数据表 |
8400 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Copper Alloy |
|
|
08-3518-00CONN IC DIP SOCKET 8POS GOLD |
947 | - |
|
数据表 |
518 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
110-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
3,002 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-93-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
2,715 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-44-328-41-001000CONN IC DIP SOCKET 28POS TIN |
1,520 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-44-628-41-001000CONN IC DIP SOCKET 28POS TIN |
1,002 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
940-44-044-17-400000CONN SOCKET PLCC 44POS TIN |
4,947 | - |
|
数据表 |
940 | Tube | Active | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
8444-11B1-RK-TPCONN SOCKET PLCC 44POS TIN |
1,492 | - |
|
数据表 |
8400 | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Copper Alloy |
|
8444-21B1-RK-TPCONN SOCKET PLCC 44POS TIN |
2,201 | - |
|
数据表 |
8400 | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Copper Alloy |
|
A-CCS 068-Z-TCONN SOCKET PLCC 68POS TIN |
1,252 | - |
|
数据表 |
- | Tube | Active | PLCC | 68 (4 x 17) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
|
917-43-103-41-005000CONN TRANSIST TO-5 3POS GOLD |
932 | - |
|
数据表 |
917 | Tube | Active | Transistor, TO-5 | 3 (Round) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
