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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
243-28-1-06

243-28-1-06

CONN IC DIP SOCKET 28POS TIN

CNC Tech

1,524 -
243-28-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
1-2199298-6

1-2199298-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

2,473 -
1-2199298-6

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
D01-9970242

D01-9970242

CONN SOCKET SIP 2POS GOLD

Harwin Inc.

16,032 -
D01-9970242

数据表

D01-997 Bag Active SIP 2 (1 x 2) Gold Flash Beryllium Copper Threaded - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
XR2C-0311-N

XR2C-0311-N

CONN SOCKET SIP 3POS GOLD

Omron Electronics Inc-EMC Div

3,654 -
XR2C-0311-N

数据表

XR2 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Beryllium Copper
245-24-1-06

245-24-1-06

CONN IC DIP SOCKET 24POS TIN

CNC Tech

2,060 -
245-24-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
110-44-306-41-001000

110-44-306-41-001000

CONN IC DIP SOCKET 6POS TIN

Mill-Max Manufacturing Corp.

1,701 -
110-44-306-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 08-HZL/01-TT

AR 08-HZL/01-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

6,895 -
AR 08-HZL/01-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
D01-9970642

D01-9970642

CONN SOCKET SIP 6POS GOLD

Harwin Inc.

28,251 -
D01-9970642

数据表

D01-997 Tube Active SIP 6 (1 x 6) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
AR 20-HZL-TT

AR 20-HZL-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

1,980 -
AR 20-HZL-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
245-28-1-06

245-28-1-06

CONN IC DIP SOCKET 28POS TIN

CNC Tech

1,068 -
245-28-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
D01-9970542

D01-9970542

CONN SOCKET SIP 5POS GOLD

Harwin Inc.

2,593 -
D01-9970542

数据表

D01-997 Tube Active SIP 5 (1 x 5) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
210-1-08-003

210-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

2,927 -
210-1-08-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
4808-3000-CP

4808-3000-CP

CONN IC DIP SOCKET 8POS TIN

3M

24,688 -
4808-3000-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
243-40-1-06

243-40-1-06

CONN IC DIP SOCKET 40POS TIN

CNC Tech

1,711 -
243-40-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
4816-3000-CP

4816-3000-CP

CONN IC DIP SOCKET 16POS TIN

3M

11,180 -
4816-3000-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
4814-3004-CP

4814-3004-CP

CONN IC DIP SOCKET 14POS TIN

3M

9,841 -
4814-3004-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
4814-3000-CP

4814-3000-CP

CONN IC DIP SOCKET 14POS TIN

3M

8,797 -
4814-3000-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
SA103000

SA103000

CONN IC DIP SOCKET 10POS GOLD

On Shore Technology Inc.

3,976 -
SA103000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
110-99-308-41-001000

110-99-308-41-001000

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

2,011 -
110-99-308-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
1-2199298-8

1-2199298-8

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

1,238 -
1-2199298-8

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
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