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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-43-628-41-001000

110-43-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

1,110 -
110-43-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
25-0513-10

25-0513-10

CONN SOCKET SIP 25POS GOLD

Aries Electronics

304 -
25-0513-10

数据表

0513 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-0518-10

40-0518-10

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2,062 -
40-0518-10

数据表

518 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-43-632-41-001000

110-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

984 -
110-43-632-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-640-41-001000

110-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

653 -
110-93-640-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-628-41-001000

110-13-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

1,430 -
110-13-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
40-6518-10

40-6518-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

717 -
40-6518-10

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
D01-9953242

D01-9953242

CONN SOCKET SIP 32POS GOLD

Harwin Inc.

1,247 -
D01-9953242

数据表

D01-995 Bulk Active SIP 32 (1 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
299-43-314-10-001000

299-43-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

367 -
299-43-314-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
TDU03DTON

TDU03DTON

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions

262 -
TDU03DTON

数据表

- Tray Active Transistor 3 (Rectangular) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide - Solder - -55°C ~ 175°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Beryllium Copper
TDU03DTOD

TDU03DTOD

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions

213 -
TDU03DTOD

数据表

- Tray Active Transistor 3 (Rectangular) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange - Solder - -55°C ~ 175°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Beryllium Copper
714-43-164-31-018000

714-43-164-31-018000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

223 -
714-43-164-31-018000

数据表

714 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
28-6554-11

28-6554-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

145 -
28-6554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
214-3339-00-0602J

214-3339-00-0602J

CONN IC DIP SOCKET ZIF 14POS GLD

3M

312 -
214-3339-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
224-1275-00-0602J

224-1275-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

199 -
224-1275-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
216-3340-00-0602J

216-3340-00-0602J

CONN IC DIP SOCKET ZIF 16POS GLD

3M

565 -
216-3340-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
208-7391-55-1902

208-7391-55-1902

CONN SOCKET SOIC 8POS GOLD

3M

298 -
208-7391-55-1902

数据表

Textool™ Bulk Active SOIC 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Gold Polyethersulfone (PES), Glass Filled 30.0µin (0.76µm) Beryllium Copper
248-1282-00-0602J

248-1282-00-0602J

CONN IC DIP SOCKET ZIF 48POS GLD

3M

614 -
248-1282-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
216-7224-55-1902

216-7224-55-1902

CONN SOCKET SOIC 16POS GOLD

3M

228 -
216-7224-55-1902

数据表

Textool™ Bulk Active SOIC 16 (2 x 8) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Gold Polyethersulfone (PES), Glass Filled 30.0µin (0.76µm) Beryllium Copper
203-2737-55-1102

203-2737-55-1102

CONN TRANSIST TO-3/TO-66 3POS

3M

72 -
203-2737-55-1102

数据表

Textool™ Bulk Active Transistor, TO-3 and TO-66 3 (Rectangular) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder 0.234" (5.94mm) -55°C ~ 150°C Gold Polyphenylene Sulfide (PPS), Glass Filled 30.0µin (0.76µm) Beryllium Copper
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