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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
508-AG11D-LF

508-AG11D-LF

IC Socket, DIP8, 8 Contact(s), 2

TE Connectivity

6,542 -
508-AG11D-LF

数据表

* Tube Obsolete - - - - - - - - - - - - - - -
1-1825094-4

1-1825094-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825094-4

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 30.0µin (0.76µm) Beryllium Copper
2-640361-4

2-640361-4

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
2-640361-4

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 15.0µin (0.38µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic 15.0µin (0.38µm) Beryllium Copper
1-1571995-0

1-1571995-0

CONN SOCKET SIP 10POS TIN

TE Connectivity AMP Connectors

0 -
1-1571995-0

数据表

510 Tube Obsolete SIP 10 (2 x 5) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Thermoplastic, Polyester 20.0µin (0.51µm) Copper
714-43-103-31-018000

714-43-103-31-018000

CONN SOCKET SIP 3POS GOLD

Mill-Max Manufacturing Corp.

1,358 -
714-43-103-31-018000

数据表

714 Bulk Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
110-87-322-41-001101

110-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,247 -
110-87-322-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
816-AG11D-ES

816-AG11D-ES

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
816-AG11D-ES

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester 80.0µin (2.03µm) Copper Alloy
346-93-104-41-013000

346-93-104-41-013000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

597 -
346-93-104-41-013000

数据表

346 Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
1825376-2

1825376-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
1825376-2

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
210-43-308-41-001

210-43-308-41-001

IC SOCKET 8-PIN .100" X .300" MA

Mill-Max Manufacturing Corp.

779 -
210-43-308-41-001

数据表

210 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
818-AG11D-ESL-LF

818-AG11D-ESL-LF

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
818-AG11D-ESL-LF

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Copper
822516-4

822516-4

CONN SOCKET PLCC 52POS TIN

TE Connectivity AMP Connectors

0 -
822516-4

数据表

- Tube Obsolete PLCC 52 (4 x 13) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Thermoplastic 100.0µin (2.54µm) Phosphor Bronze
3-822516-4

3-822516-4

CONN SOCKET PLCC 52POS TIN

TE Connectivity AMP Connectors

0 -
3-822516-4

数据表

- Tape & Reel (TR) Obsolete PLCC 52 (4 x 13) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Thermoplastic 100.0µin (2.54µm) Phosphor Bronze
1-1814655-5

1-1814655-5

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

4,391 -
1-1814655-5

数据表

- Bulk Obsolete SIP 20 (1 x 20) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic, Polyester 196.9µin (5.00µm) Brass
818-AG11D-ESL

818-AG11D-ESL

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
818-AG11D-ESL

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester 80.0µin (2.03µm) Copper Alloy
4-1571551-2

4-1571551-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571551-2

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Nickel
211-1-20-003

211-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

216 -
211-1-20-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
346-93-105-41-013000

346-93-105-41-013000

CONN SOCKET SIP 5POS GOLD

Mill-Max Manufacturing Corp.

261 -
346-93-105-41-013000

数据表

346 Bulk Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
820-AG11D-ESL-LF

820-AG11D-ESL-LF

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
820-AG11D-ESL-LF

数据表

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Copper
2-1571552-6

2-1571552-6

820-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

1,260 -
2-1571552-6

数据表

* Tube Active - - - - - - - - - - - - - - -
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