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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
520-AG11D-ES

520-AG11D-ES

DIP SOCKET T/H 20POS

TE Connectivity AMP Connectors

0 -
520-AG11D-ES

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
50950-0084N-002

50950-0084N-002

1.27MM PITCH WINBOND SOCKET CONN

Aces Connectors

775 -
50950-0084N-002

数据表

50950 Cut Tape (CT) Active PLCC 8 Tin 80.0µin (2.03µm) Copper Alloy Surface Mount - 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Thermoplastic 80.0µin (2.03µm) Copper Alloy
110-83-320-41-001101

110-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

456 -
110-83-320-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1-1825376-2

1-1825376-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825376-2

数据表

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 30.0µin (0.76µm) Beryllium Copper
1-1571552-0

1-1571552-0

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

0 -
1-1571552-0

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Copper
4-1571552-6

4-1571552-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571552-6

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 20.0µin (0.51µm) Copper
346-93-109-41-013000

346-93-109-41-013000

CONN SOCKET SIP 9POS GOLD

Mill-Max Manufacturing Corp.

175 -
346-93-109-41-013000

数据表

346 Bulk Active SIP 9 (1 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-308-T-A

APA-308-T-A

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-T-A

数据表

APA Bulk Active - 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APO-308-T-A

APO-308-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-308-T-A

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
714-43-204-31-018000

714-43-204-31-018000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

1,545 -
714-43-204-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
2-1571551-6

2-1571551-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571551-6

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester - Copper Alloy
824-AG31D-ES

824-AG31D-ES

CONN IC DIP SOCKET 24POS TINLEAD

TE Connectivity AMP Connectors

0 -
824-AG31D-ES

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead - Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
516-AG10D-ES

516-AG10D-ES

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
516-AG10D-ES

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - - - Brass
828-AG11D-ES

828-AG11D-ES

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
828-AG11D-ES

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
9-1437539-1

9-1437539-1

828-AG11D-ES=SOCKET ASSY

TE Connectivity AMP Connectors

1,245 -
9-1437539-1

数据表

800 Box Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) Gold 25.0µin (0.63µm) Copper Alloy Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
210-43-316-41-001

210-43-316-41-001

SOCKET 16-PIN .100" X .300" MACH

Mill-Max Manufacturing Corp.

411 -
210-43-316-41-001

数据表

210 Box Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
SMPX-84LCC-P

SMPX-84LCC-P

SMT PLCC SOCKET 84P POLARISED RO

Kycon, Inc.

195 -
SMPX-84LCC-P

数据表

SMPX Tube Active PLCC 84 (4 x 21) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
714-43-108-31-018000

714-43-108-31-018000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

646 -
714-43-108-31-018000

数据表

714 Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
816-AG11D

816-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
816-AG11D

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
1-1437540-7

1-1437540-7

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
1-1437540-7

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
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