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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICA-640-SGT

ICA-640-SGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

15 -
ICA-640-SGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
115-93-306-41-001000

115-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

133 -
115-93-306-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-310-41-105000

110-93-310-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

1,148 -
110-93-310-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-210-41-105000

110-43-210-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

154 -
110-43-210-41-105000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-314-41-105000

110-43-314-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

161 -
110-43-314-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-316-41-105000

110-43-316-41-105000

SOCKET IC .300 16POS SMD

Mill-Max Manufacturing Corp.

173 -
110-43-316-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-310-41-001000

110-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

956 -
110-13-310-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
210-13-640-41-001000

210-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,135 -
210-13-640-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
299-43-324-11-001000

299-43-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

176 -
299-43-324-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
1-2397198-1

1-2397198-1

SOCKET 4710 FOR ODM

TE Connectivity AMP Connectors

0 -
1-2397198-1

数据表

- Tray Active LGA 4710 Gold 30.0µin (0.76µm) Copper Alloy Surface Mount - 0.031" (0.80mm) Solder 0.031" (0.80mm) -40°C ~ 100°C Tin Thermoplastic - Copper Alloy
1674770-7

1674770-7

HARD TRAY ASSY MPGA479M W/TAPE

TE Connectivity AMP Connectors

6,240 -
1674770-7

数据表

- Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Thermoplastic 30.0µin (0.76µm) Copper Alloy
1-390263-1

1-390263-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0 -
1-390263-1

数据表

- Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 60.0µin (1.52µm) Phosphor Bronze
2-641296-4

2-641296-4

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
2-641296-4

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
2-382462-3

2-382462-3

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
2-382462-3

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic - Phosphor Bronze
1-390262-1

1-390262-1

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

0 -
1-390262-1

数据表

- Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - - Phosphor Bronze
2-382568-0

2-382568-0

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
2-382568-0

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
02-0518-10

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

12,441 -
02-0518-10

数据表

518 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
2-382465-3

2-382465-3

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
2-382465-3

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic - Phosphor Bronze
346-43-101-41-013000

346-43-101-41-013000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.

1,753 -
346-43-101-41-013000

数据表

346 Bulk Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
211-1-06-003

211-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

7,352 -
211-1-06-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
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