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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
714-43-104-31-018000

714-43-104-31-018000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

1,096 -
714-43-104-31-018000

数据表

714 Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
4-1571551-3

4-1571551-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571551-3

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Nickel
211-1-24-006

211-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

785 -
211-1-24-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
4-1571552-5

4-1571552-5

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
4-1571552-5

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 20.0µin (0.51µm) Copper
2-1437531-0

2-1437531-0

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1437531-0

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold - - Copper Alloy
7-1437529-9

7-1437529-9

7-1437529-9

TE Connectivity

1,462 -
7-1437529-9

数据表

500 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester 25.0µin (0.63µm) Copper Alloy
2-641615-2

2-641615-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

535 -
2-641615-2

数据表

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 30.0µin (0.76µm) Beryllium Copper
1437540-5

1437540-5

CONN IC DIP SOCKET 32POS TINLEAD

TE Connectivity Potter & Brumfield Relays

0 -
1437540-5

数据表

800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
211-1-28-006

211-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech

281 -
211-1-28-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
346-93-106-41-013000

346-93-106-41-013000

CONN SOCKET SIP 6POS GOLD

Mill-Max Manufacturing Corp.

162 -
346-93-106-41-013000

数据表

346 Tube Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-308-T-A1

APA-308-T-A1

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-T-A1

数据表

APA Bulk Active - 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
115-47-318-41-003000

115-47-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

182 -
115-47-318-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
816-AG12D-ES-LF

816-AG12D-ES-LF

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

0 -
816-AG12D-ES-LF

数据表

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Copper
50951-0084N-001

50951-0084N-001

1.27MM SPI ROM SOCKET CONN SMT S

Aces Connectors

955 -
50951-0084N-001

数据表

50951 Cut Tape (CT) Active SIP 8 Tin 80.0µin (2.03µm) Copper Alloy Surface Mount - 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Thermoplastic 80.0µin (2.03µm) Copper Alloy
50960-0084N-001

50960-0084N-001

1.27MM PITCH SPI FLASH SOCKET CO

Aces Connectors

689 -
50960-0084N-001

数据表

50960 Cut Tape (CT) Active SIP 8 Tin 100.0µin (2.54µm) Copper Alloy Surface Mount - 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Thermoplastic 100.0µin (2.54µm) Copper Alloy
91960-0084N

91960-0084N

8P, 1.27MM PSI FLASH SOCKET, SMT

Aces Connectors

677 -
91960-0084N

数据表

91960 Cut Tape (CT) Active DIP, ZIF (ZIP) 8 Tin 50.0µin (1.27µm) Copper Alloy Surface Mount - 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 85°C Tin Thermoplastic 50.0µin (1.27µm) Copper Alloy
AR 16-HZL/07-TT

AR 16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

1,391 -
AR 16-HZL/07-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
1814640-8

1814640-8

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
1814640-8

数据表

- Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Brass
5-1571552-6

5-1571552-6

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
5-1571552-6

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 20.0µin (0.51µm) Copper
824-AG11D-ESL-LF

824-AG11D-ESL-LF

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
824-AG11D-ESL-LF

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Copper
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