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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-83-316-10-003101

110-83-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,664 -
110-83-316-10-003101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2445893-3

2445893-3

DIP IC SOCKET 20P SMT

TE Connectivity AMP Connectors

3,000 -
2445893-3

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
D2608-42

D2608-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2,312 -
D2608-42

数据表

D26 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
2485264-4

2485264-4

DIP IC SOCKET 18P,GOLD FLASH

TE Connectivity AMP Connectors

5,280 -
2485264-4

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2445893-2

2445893-2

DIP IC SOCKET 16P SMT

TE Connectivity AMP Connectors

3,000 -
2445893-2

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
ICO-308-STT

ICO-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

111 -
ICO-308-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
2485264-7

2485264-7

DIP IC SOCKET 28P,GOLD FLASH

TE Connectivity AMP Connectors

3,822 -
2485264-7

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
116-83-314-41-006101

116-83-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,396 -
116-83-314-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SMPX-52LCC-P

SMPX-52LCC-P

SMT PLCC SOCKET 52P POLARISED RO

Kycon, Inc.

203 -
SMPX-52LCC-P

数据表

SMPX Tube Active PLCC 52 (4 x 13) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
146-43-308-41-013000

146-43-308-41-013000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

120 -
146-43-308-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-83-320-41-001101

115-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

237 -
115-83-320-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-624-41-001101

110-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,016 -
110-83-624-41-001101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
940-44-032-17-400004

940-44-032-17-400004

CONN SOCKET PLCC 32POS SMD

Mill-Max Manufacturing Corp.

390 -
940-44-032-17-400004

数据表

940 Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
ICO-314-MTT

ICO-314-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

11 -
ICO-314-MTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
8452-21B1-RK-TR

8452-21B1-RK-TR

CONN SOCKET PLCC 52POS TIN

3M

1,857 -
8452-21B1-RK-TR

数据表

8400 Tape & Reel (TR) Active PLCC 52 (4 x 13) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
4602

4602

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

1,759 -
4602

数据表

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polyester, Glass Filled - Brass
2485265-1

2485265-1

DIP IC SOCKET 40P,GOLD FLASH

TE Connectivity AMP Connectors

1,950 -
2485265-1

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
540-44-032-17-400004

540-44-032-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

800 -
540-44-032-17-400004

数据表

540 Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
123-83-316-41-001101

123-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,058 -
123-83-316-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-93-424-41-001000

110-93-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

183 -
110-93-424-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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