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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
2444090-3

2444090-3

CONN SOCKET SIP 16POS GOLD

TE Connectivity AMP Connectors

0 -
2444090-3

数据表

- Bulk Active SIP 16 Gold Flash Copper Alloy Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2444090-5

2444090-5

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

0 -
2444090-5

数据表

- Bulk Active SIP 20 Gold Flash Copper Alloy Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485267-1

2485267-1

DIP IC SOCKET 6P,GOLD FLASH-SMD

TE Connectivity AMP Connectors

5,400 -
2485267-1

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 6 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485267-2

2485267-2

DIP IC SOCKET 8P,GOLD FLASH-SMD

TE Connectivity AMP Connectors

5,397 -
2485267-2

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485267-3

2485267-3

DIP IC SOCKET 10P,GOLD FLASH-SMD

TE Connectivity AMP Connectors

5,400 -
2485267-3

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 10 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485267-4

2485267-4

DIP IC SOCKET 12P,GOLD FLASH-SMD

TE Connectivity AMP Connectors

5,399 -
2485267-4

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 12 Gold Flash Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
ICF-308-T-I-TR

ICF-308-T-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

950 -
ICF-308-T-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
05-0518-00

05-0518-00

CONN SOCKET SIP 5POS GOLD

Aries Electronics

885 -
05-0518-00

数据表

518 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
115-47-308-41-003000

115-47-308-41-003000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,067 -
115-47-308-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
2445893-1

2445893-1

DIP IC SOCKET 8P SMT

TE Connectivity AMP Connectors

4,500 -
2445893-1

数据表

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 Gold Flash Copper Alloy Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
SMPX-32LCC-N

SMPX-32LCC-N

SMT PLCC SOCKET 32P NON POLARISE

Kycon, Inc.

179 -
SMPX-32LCC-N

数据表

SMPX Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
2444090-1

2444090-1

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

0 -
2444090-1

数据表

- Bulk Active SIP 10 Gold 29.5µin (0.75µm) Copper Alloy Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485264-5

2485264-5

DIP IC SOCKET 18P,SN

TE Connectivity AMP Connectors

5,720 -
2485264-5

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
8420-21A1-RK-TP

8420-21A1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

2,808 -
8420-21A1-RK-TP

数据表

8400 Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
2485264-2

2485264-2

DIP IC SOCKET 14P-SN

TE Connectivity AMP Connectors

7,641 -
2485264-2

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2444090-4

2444090-4

SIP IC SKT 20 AU0.75

TE Connectivity AMP Connectors

0 -
2444090-4

数据表

- Tray Active SIP 20 Gold 30.0µin (0.76µm) Copper Alloy Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485264-6

2485264-6

DIP IC SOCKET 20P,SN

TE Connectivity AMP Connectors

5,228 -
2485264-6

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
2485264-3

2485264-3

DIP IC SOCKET 16P,SN

TE Connectivity AMP Connectors

6,519 -
2485264-3

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic 78.7µin (2.00µm) Copper Alloy
8420-21B1-RK-TR

8420-21B1-RK-TR

CONN SOCKET PLCC 20POS TIN

3M

1,286 -
8420-21B1-RK-TR

数据表

8400 Tape & Reel (TR) Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
214-44-308-01-670799

214-44-308-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

1,000 -
214-44-308-01-670799

数据表

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass Alloy
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