富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
42-6574-11

42-6574-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
42-6574-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
42-6575-11

42-6575-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
42-6575-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
44-6571-11

44-6571-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

0 -
44-6571-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
HLS-0620-T-22

HLS-0620-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0620-T-22

数据表

HLS Bulk Active SIP 120 (6 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
510-41-169-17-101002

510-41-169-17-101002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-169-17-101002

数据表

510 Bulk Active PGA 169 (17 x 17) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
110-13-964-61-001000

110-13-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-964-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
518-77-192M16-001106

518-77-192M16-001106

CONN SOCKET PGA 192POS GOLD

Preci-Dip

0 -
518-77-192M16-001106

数据表

518 Bulk Active PGA 192 (16 x 16) Gold Flash Beryllium Copper Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass Flash Brass
APH-1836-G-T

APH-1836-G-T

APH-1836-G-T

Samtec Inc.

0 -
APH-1836-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0536-G-T

APH-0536-G-T

APH-0536-G-T

Samtec Inc.

0 -
APH-0536-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0236-G-T

APH-0236-G-T

APH-0236-G-T

Samtec Inc.

0 -
APH-0236-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0736-G-T

APH-0736-G-T

APH-0736-G-T

Samtec Inc.

0 -
APH-0736-G-T

数据表

* - Active - - - - - - - - - - - - - - -
110-83-640-41-005101

110-83-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
110-83-640-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-640-41-605101

110-83-640-41-605101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
110-83-640-41-605101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0107-T-30

HLS-0107-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0107-T-30

数据表

HLS Tube Active SIP 7 (1 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
2-1437539-2

2-1437539-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1437539-2

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
APH-1336-G-T

APH-1336-G-T

APH-1336-G-T

Samtec Inc.

0 -
APH-1336-G-T

数据表

* - Active - - - - - - - - - - - - - - -
299-83-312-10-001101

299-83-312-10-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
299-83-312-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1236-G-T

APH-1236-G-T

APH-1236-G-T

Samtec Inc.

0 -
APH-1236-G-T

数据表

* - Active - - - - - - - - - - - - - - -
24-6518-00

24-6518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-00

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0336-G-T

APH-0336-G-T

APH-0336-G-T

Samtec Inc.

0 -
APH-0336-G-T

数据表

* - Active - - - - - - - - - - - - - - -
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户