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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
42-6574-11CONN IC DIP SOCKET ZIF 42POS TIN |
0 | - |
|
数据表 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
42-6575-11CONN IC DIP SOCKET ZIF 42POS TIN |
0 | - |
|
数据表 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
44-6571-11CONN IC DIP SOCKET ZIF 44POS GLD |
0 | - |
|
数据表 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
HLS-0620-T-22.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Bulk | Active | SIP | 120 (6 x 20) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | - | Thermoplastic | - | - |
|
510-41-169-17-101002SKT PGA SOLDRTL |
0 | - |
|
数据表 |
510 | Bulk | Active | PGA | 169 (17 x 17) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
110-13-964-61-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
518-77-192M16-001106CONN SOCKET PGA 192POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | PGA | 192 (16 x 16) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | Flash | Brass |
|
APH-1836-G-TAPH-1836-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0536-G-TAPH-0536-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0236-G-TAPH-0236-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0736-G-TAPH-0736-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
110-83-640-41-005101CONN IC DIP SOCKET 40POS GOLD |
0 | - |
|
数据表 |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
110-83-640-41-605101CONN IC DIP SOCKET 40POS GOLD |
0 | - |
|
数据表 |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
HLS-0107-T-30.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Tube | Active | SIP | 7 (1 x 7) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | - | Thermoplastic | - | - |
|
2-1437539-2CONN IC DIP SOCKET 14POS GOLD |
0 | - |
|
数据表 |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
APH-1336-G-TAPH-1336-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
299-83-312-10-001101CONN IC DIP SOCKET 12POS GOLD |
0 | - |
|
数据表 |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
APH-1236-G-TAPH-1236-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
24-6518-00CONN IC DIP SOCKET 24POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
APH-0336-G-TAPH-0336-G-T |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
