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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-964-61-006000

116-43-964-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-964-61-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-964-61-006000

116-93-964-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-964-61-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
14-C195-10

14-C195-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-C195-10

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
612-87-642-41-001101

612-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
612-87-642-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 24-HZW/TN

AR 24-HZW/TN

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
AR 24-HZW/TN

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
116-87-428-41-008101

116-87-428-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-428-41-008101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
27-0518-10

27-0518-10

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0518-10

数据表

518 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-83-628-31-012101

614-83-628-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
614-83-628-31-012101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-428-41-018101

116-83-428-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-428-41-018101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
124-83-318-41-002101

124-83-318-41-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
124-83-318-41-002101

数据表

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
3-1437535-1

3-1437535-1

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

0 -
3-1437535-1

数据表

- Bulk Obsolete SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Thermoplastic, Polyester 30.0µin (0.76µm) Beryllium Copper
614-87-640-41-001101

614-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
614-87-640-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0120-TT-2

HLS-0120-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-TT-2

数据表

HLS Tube Active SIP 20 (1 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
34-0518-10T

34-0518-10T

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
34-0518-10T

数据表

518 Bulk Active SIP 34 (1 x 34) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
10-0517-90C

10-0517-90C

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0517-90C

数据表

0517 Bulk Active SIP 10 (1 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-424-41-009101

116-87-424-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-424-41-009101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-322-41-008101

116-83-322-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-322-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-83-640-41-005101

117-83-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
117-83-640-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-322-41-035101

146-83-322-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-83-322-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-322-41-036101

146-83-322-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-83-322-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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