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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
40-0518-10T

40-0518-10T

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
40-0518-10T

数据表

518 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
122-83-624-41-001101

122-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
122-83-624-41-001101

数据表

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APO-640-G-B

APO-640-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-640-G-B

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-43-964-61-003000

116-43-964-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-964-61-003000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-964-61-003000

116-93-964-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-964-61-003000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
88-PGM13028-10H

88-PGM13028-10H

CONN SOCKET PGA GOLD

Aries Electronics

0 -
88-PGM13028-10H

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
614-87-279-19-081112

614-87-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip

0 -
614-87-279-19-081112

数据表

614 Bulk Active PGA 279 (19 x 19) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-0528-G-H

APH-0528-G-H

APH-0528-G-H

Samtec Inc.

0 -
APH-0528-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1628-G-H

APH-1628-G-H

APH-1628-G-H

Samtec Inc.

0 -
APH-1628-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1328-G-H

APH-1328-G-H

APH-1328-G-H

Samtec Inc.

0 -
APH-1328-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0228-G-H

APH-0228-G-H

APH-0228-G-H

Samtec Inc.

0 -
APH-0228-G-H

数据表

* - Active - - - - - - - - - - - - - - -
1437522-4

1437522-4

CONN SOCKET PGA 321POS GOLD

TE Connectivity AMP Connectors

0 -
1437522-4

数据表

- Bulk Active PGA 321 (19 x 19) Gold 10.0µin (0.25µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Thermoplastic, Polyester - Copper Alloy
APH-0534-G-R

APH-0534-G-R

APH-0534-G-R

Samtec Inc.

0 -
APH-0534-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0934-G-R

APH-0934-G-R

APH-0934-G-R

Samtec Inc.

0 -
APH-0934-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1034-G-R

APH-1034-G-R

APH-1034-G-R

Samtec Inc.

0 -
APH-1034-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0734-G-R

APH-0734-G-R

APH-0734-G-R

Samtec Inc.

0 -
APH-0734-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1334-G-R

APH-1334-G-R

APH-1334-G-R

Samtec Inc.

0 -
APH-1334-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0434-G-R

APH-0434-G-R

APH-0434-G-R

Samtec Inc.

0 -
APH-0434-G-R

数据表

* - Active - - - - - - - - - - - - - - -
116-43-950-61-008000

116-43-950-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-950-61-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-950-61-008000

116-93-950-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-950-61-008000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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