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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
42-3573-11

42-3573-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-3573-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
42-3574-11

42-3574-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
42-3574-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
42-3575-11

42-3575-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
42-3575-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
21-0513-10T

21-0513-10T

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0513-10T

数据表

0513 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
23-0518-10H

23-0518-10H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0518-10H

数据表

518 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
121-83-624-41-001101

121-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
121-83-624-41-001101

数据表

121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-628-41-002101

116-87-628-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-628-41-002101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-320-LTT

ICO-320-LTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-LTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
822-AG11D

822-AG11D

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

0 -
822-AG11D

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester 80.0µin (2.03µm) Copper Alloy
346-43-109-41-013000

346-43-109-41-013000

CONN SOCKET SIP 9POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-109-41-013000

数据表

346 Bulk Active SIP 9 (1 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-107-31-018000

714-43-107-31-018000

CONN SOCKET SIP 7POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-107-31-018000

数据表

714 Bulk Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
19-0513-10H

19-0513-10H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0513-10H

数据表

0513 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
42-1518-10T

42-1518-10T

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
115-87-952-41-001101

115-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
115-87-952-41-001101

数据表

115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-328-41-003101

116-83-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-328-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-088-13-001101

510-87-088-13-001101

CONN SOCKET PGA 88POS GOLD

Preci-Dip

0 -
510-87-088-13-001101

数据表

510 Bulk Active PGA 88 (13 x 13) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2-1571550-4

2-1571550-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571550-4

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Beryllium Copper
614-83-632-41-001101

614-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
614-83-632-41-001101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
42-6571-11

42-6571-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-6571-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
42-6572-11

42-6572-11

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

0 -
42-6572-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
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