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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1528-G-T

APH-1528-G-T

APH-1528-G-T

Samtec Inc.

0 -
APH-1528-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1928-G-T

APH-1928-G-T

APH-1928-G-T

Samtec Inc.

0 -
APH-1928-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0228-G-T

APH-0228-G-T

APH-0228-G-T

Samtec Inc.

0 -
APH-0228-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1128-G-T

APH-1128-G-T

APH-1128-G-T

Samtec Inc.

0 -
APH-1128-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0328-G-T

APH-0328-G-T

APH-0328-G-T

Samtec Inc.

0 -
APH-0328-G-T

数据表

* - Active - - - - - - - - - - - - - - -
116-43-952-61-007000

116-43-952-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-952-61-007000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-952-61-007000

116-93-952-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-952-61-007000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1926-G-R

APH-1926-G-R

APH-1926-G-R

Samtec Inc.

0 -
APH-1926-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1426-G-R

APH-1426-G-R

APH-1426-G-R

Samtec Inc.

0 -
APH-1426-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0326-G-R

APH-0326-G-R

APH-0326-G-R

Samtec Inc.

0 -
APH-0326-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1726-G-R

APH-1726-G-R

APH-1726-G-R

Samtec Inc.

0 -
APH-1726-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0226-G-R

APH-0226-G-R

APH-0226-G-R

Samtec Inc.

0 -
APH-0226-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1226-G-R

APH-1226-G-R

APH-1226-G-R

Samtec Inc.

0 -
APH-1226-G-R

数据表

* - Active - - - - - - - - - - - - - - -
HLS-0420-T-12

HLS-0420-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0420-T-12

数据表

HLS Bulk Active SIP 80 (4 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-43-648-61-001000

116-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-648-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-648-61-001000

116-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-648-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-C300-21

40-C300-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C300-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
42-3570-11

42-3570-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-3570-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
42-3571-11

42-3571-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-3571-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
42-3572-11

42-3572-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

0 -
42-3572-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
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