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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0826-G-T

APH-0826-G-T

APH-0826-G-T

Samtec Inc.

0 -
APH-0826-G-T

数据表

* - Active - - - - - - - - - - - - - - -
HLS-0420-TT-18

HLS-0420-TT-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0420-TT-18

数据表

HLS Bulk Active SIP 80 (4 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
517-83-428-19-101111

517-83-428-19-101111

CONN SOCKET PGA 428POS GOLD

Preci-Dip

0 -
517-83-428-19-101111

数据表

517 Bulk Active PGA 428 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
44-6556-31

44-6556-31

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

0 -
44-6556-31

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
517-83-429-19-101111

517-83-429-19-101111

CONN SOCKET PGA 429POS GOLD

Preci-Dip

0 -
517-83-429-19-101111

数据表

517 Bulk Active PGA 429 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-428-31-012101

614-83-428-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
614-83-428-31-012101

数据表

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-43-950-61-007000

116-43-950-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-950-61-007000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-87-640-41-105101

110-87-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
110-87-640-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
516-AG12D-LF

516-AG12D-LF

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

0 -
516-AG12D-LF

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Beryllium Copper
116-93-950-61-007000

116-93-950-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-950-61-007000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
121-83-324-41-001101

121-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
121-83-324-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
14-C280-10

14-C280-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-C280-10

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
06-6503-20

06-6503-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
06-6503-30

06-6503-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
34-1518-10T

34-1518-10T

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
37-0518-10

37-0518-10

CONN SOCKET SIP 37POS GOLD

Aries Electronics

0 -
37-0518-10

数据表

518 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
09-0508-20

09-0508-20

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0508-20

数据表

508 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
09-0508-30

09-0508-30

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0508-30

数据表

508 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
558-10-192M16-001104

558-10-192M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
558-10-192M16-001104

数据表

558 Bulk Active BGA 192 (16 x 16) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
550-80-296-19-131135

550-80-296-19-131135

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-296-19-131135

数据表

550 Bulk Active PGA 296 (19 x 19) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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