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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICO-318-STT-L

ICO-318-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-STT-L

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
16-3513-11

16-3513-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
ICF-316-FM-O-TR

ICF-316-FM-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-316-FM-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
116-87-422-41-008101

116-87-422-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-422-41-008101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
520-AG10D-ES

520-AG10D-ES

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
520-AG10D-ES

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - - - Brass
110-83-432-41-005101

110-83-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-83-432-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D2628-42

D2628-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

0 -
D2628-42

数据表

D26 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
116-83-422-41-018101

116-83-422-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-422-41-018101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2-1571995-0

2-1571995-0

CONN SOCKET SIP 20POS TIN

TE Connectivity AMP Connectors

0 -
2-1571995-0

数据表

510 Tube Obsolete SIP 20 (2 x 10) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Thermoplastic, Polyester 20.0µin (0.51µm) Copper
APH-1402-T-R

APH-1402-T-R

APH-1402-T-R

Samtec Inc.

0 -
APH-1402-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1502-T-R

APH-1502-T-R

APH-1502-T-R

Samtec Inc.

0 -
APH-1502-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0602-T-R

APH-0602-T-R

APH-0602-T-R

Samtec Inc.

0 -
APH-0602-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0302-T-R

APH-0302-T-R

APH-0302-T-R

Samtec Inc.

0 -
APH-0302-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1702-T-R

APH-1702-T-R

APH-1702-T-R

Samtec Inc.

0 -
APH-1702-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1802-T-R

APH-1802-T-R

APH-1802-T-R

Samtec Inc.

0 -
APH-1802-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1302-T-R

APH-1302-T-R

APH-1302-T-R

Samtec Inc.

0 -
APH-1302-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1202-T-R

APH-1202-T-R

APH-1202-T-R

Samtec Inc.

0 -
APH-1202-T-R

数据表

* - Active - - - - - - - - - - - - - - -
510-87-068-11-001101

510-87-068-11-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
510-87-068-11-001101

数据表

510 Bulk Active PGA 68 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-068-11-061101

510-87-068-11-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
510-87-068-11-061101

数据表

510 Bulk Active PGA 68 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-068-11-062101

510-87-068-11-062101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

0 -
510-87-068-11-062101

数据表

510 Bulk Active PGA 68 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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