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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-87-428-41-003101

116-87-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-428-41-003101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-628-41-003101

115-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-83-628-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1814643-8

1814643-8

CONN IC DIP SOCKET 10POS GOLD

TE Connectivity AMP Connectors

0 -
1814643-8

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Thermoplastic, Polyester - Brass
146-87-322-41-035101

146-87-322-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
146-87-322-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X28-160B

SIP050-1X28-160B

1X28-160B-SIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X28-160B

数据表

SIP050-1x Bulk Active SIP 28 (1 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
917-43-108-41-001000

917-43-108-41-001000

CONN TRANSIST TO-5 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
917-43-108-41-001000

数据表

917 Tube Active Transistor, TO-5 8 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-43-208-41-001000

917-43-208-41-001000

CONN SOCKET TRANSIST TO-100 8POS

Mill-Max Manufacturing Corp.

0 -
917-43-208-41-001000

数据表

917 Tube Active Transistor, TO-100 8 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-420-41-002101

116-87-420-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
20-0513-10

20-0513-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0513-10

数据表

0513 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
22-0513-10T

22-0513-10T

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0513-10T

数据表

0513 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-83-318-41-007101

116-83-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0204-T-2

HLS-0204-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0204-T-2

数据表

HLS Tube Active SIP 8 (2 x 4) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
114-87-642-41-117101

114-87-642-41-117101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
114-87-642-41-117101

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-87-642-41-134161

114-87-642-41-134161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
114-87-642-41-134161

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-322-41-008101

116-87-322-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-83-620-41-105101

117-83-620-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
117-83-620-41-105101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D01-9951642

D01-9951642

CONN SOCKET SIP 16POS GOLD

Harwin Inc.

0 -
D01-9951642

数据表

D01-995 Tube Obsolete SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
116-87-310-41-013101

116-87-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-312-41-004101

116-83-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-83-312-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-320-41-003101

116-83-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-320-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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